Multilayer Circuit Board Layout for High-Current Signal Crossing

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Solution Overview

Problem

In motor drive control devices, the formation of signal wiring to control switching elements in inverter circuits leads to increased board area when avoiding drive current wiring to suppress heat generation, or reduced cross-sectional area and increased wiring resistance when traversing the drive current wiring, resulting in heat-related disconnection and component failure.

Innovation Solution

A multilayer circuit board design where the power section and control calculation section are separated, with the drive current wiring featuring a same shape portion and a traversing portion with a notch for the signal wiring, allowing the signal wiring to traverse while maintaining a large cross-sectional area for the drive current wiring.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If the signal wiring is formed to traverse the drive current wiring without avoiding it, then the board area is reduced, but the cross-sectional area of the drive current wiring decreases and wiring resistance increases, causing heat generation and potential failure

Engineering Contradiction:
Improveboard areaVSAvoidwiring reliability
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

The invention utilizes the third dimension (vertical layering) by forming the signal wiring in a different conductor layer than the drive current wiring. This allows the signal wiring to traverse the drive current wiring path without reducing its cross-sectional area, as they occupy different spatial dimensions. The insulating layer between conductor layers provides electrical isolation while maintaining both wirings' integrity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The invention segments the wiring structure into multiple conductor layers, with drive current wiring in one layer and signal wiring in another. This segmentation allows independent optimization of each wiring's cross-sectional area and path, enabling the signal wiring to cross the drive current wiring without compromising either wiring's electrical properties or reliability.

Inventive Principle:
Principle #1Segmentation

2Temperature

If the signal wiring is formed while avoiding the drive current wiring, then heat generation in the drive current wiring is suppressed, but the board area increases

Engineering Contradiction:
Improvewiring temperatureVSAvoidboard area
Core Design Contradiction:
TemperatureVSArea of stationary object

Solution Approach 1:

By moving the signal wiring to a different conductor layer, the invention eliminates the need for the signal wiring to avoid the drive current wiring in the planar dimension. The signal wiring can directly traverse over the drive current wiring in the vertical dimension, maintaining minimal board area while preventing heat generation through proper layer isolation.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Reliability

If the drive current wiring cross-sectional area is increased to supply large current, then the wiring resistance decreases, but the board area increases

Engineering Contradiction:
Improvecurrent supply capabilityVSAvoidboard area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The invention increases the current supply capability by stacking multiple conductor layers with drive current wiring in each layer, forming a three-dimensional conductive structure. This vertical stacking allows the equivalent cross-sectional area to be increased without proportionally increasing the board's planar area, as the additional conductive area is achieved through the thickness dimension rather than lateral expansion.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS20240088759A1Multilayer circuit board, drive control device, and motor unit for electric power steering
Publication Date: 2024.03.14 MITSUBISHI ELECTRIC CORP
  • US20240088759A1 patent drawing
  • US20240088759A1 patent drawing
  • US20240088759A1 patent drawing

AI summary

There is provided a multilayer circuit board formed by alternately stacking conductor layers and insulating layers. A power section, in which a current is applied to an inverter circuit to which a switching element is mounted, and a control calculation section, to which a control device that controls the switching element is mounted, are disposed in different regions on the multilayer circuit board. The power section includes a drive current wiring for applying a current. The drive current wiring includes a same shape portion formed in a same shape in each of the conductor layers and a traversing portion in which a notch portion formed by notching a portion of the drive current wiring is formed at least on any one of the conductor layers. A signal wiring for transmitting a control signal of an inverter circuit mounted in the power section traverses the notch portion, and a dimension of a width of the traversing portion in a direction perpendicular to a longitudinal direction of the drive current wiring is larger than a dimension of a width of the same shape portion.