Multilayer Board Signal Isolation via Vertical Layering
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Solution Overview
Problem
Conventional multilayer boards with sub-ground conductors between signal lines do not adequately secure isolation between adjacent signal lines, leading to insufficient crosstalk reduction and radiation prevention.
Innovation Solution
The multilayer board configuration includes a first signal line, a second signal line, first and second ground conductors, a third ground conductor, interlayer connecting conductors, and sub-ground conductors, where the signal lines are positioned at different layers, and the ground conductors are connected by interlayer connecting conductors to enhance isolation and reduce crosstalk, with sub-ground conductors placed between signal lines and ground conductors to further improve radiation prevention.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If signal lines are disposed on the same layer to simplify structure, then device complexity is reduced, but isolation between signal lines deteriorates leading to increased crosstalk
Solution Approach 1:
The patent transitions from two-dimensional planar arrangement to three-dimensional layered arrangement by disposing first and second signal lines on different layers (first and second insulating base material layers). This vertical separation in the layering direction significantly increases the distance between adjacent signal lines, thereby improving isolation and reducing crosstalk while maintaining structural simplicity.
2Object-affected harmful factors
If sub-ground conductor is disposed between signal lines to improve isolation, then crosstalk reduction is enhanced, but radiation prevention remains insufficient
Solution Approach 1:
The ground conductor system is segmented into multiple components: sub-ground conductors disposed between signal lines for crosstalk reduction, and additional ground conductors (first and second ground conductors on different layers) for radiation prevention. This segmented approach allows each ground conductor to specifically address different harmful effects, with the sub-ground conductor targeting crosstalk and the layered ground conductors targeting radiation.
3Object-affected harmful factors
If distance between signal lines is increased to improve isolation, then crosstalk is reduced, but area occupied by the board increases
Solution Approach 1:
Instead of increasing horizontal distance between signal lines on the same layer, the patent utilizes the vertical dimension by disposing signal lines on different layers. This three-dimensional arrangement achieves increased separation distance and improved isolation without expanding the horizontal board area, effectively resolving the contradiction between isolation requirements and compact board design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly increases the distance between signal lines, effectively intercepts magnetic fields, and reduces unnecessary radiation, thereby achieving improved isolation and crosstalk reduction between signal lines.
Implementation Method 1
the first signal line overlaps the first opening when seen in a layering direction of the plurality of insulating base material layers
Implementation Method 2
effectively intercepts magnetic fields
Data Source
AI summary
A multilayer board includes a layered body including insulating base material layers that are laminated, and first and second signal lines, a first ground conductor including a first opening, a second ground conductor, a third ground conductor, and an interlayer connecting conductor. The first signal line overlaps the first opening when seen in a layering direction. The second signal line is provided on a layer different from a layer including the first signal line and includes a portion extending side by side with the first signal line when seen in the Z-axis direction. The first, second, and third ground conductors are connected by the interlayer connecting conductor. The third ground conductor is disposed on a layer including the first signal line or a layer positioned between the first signal line and the second signal line.