Multilayer Board Width Reduction via Laminated Ground Shielding

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Solution Overview

Problem

The challenge is to create a multilayer board that can efficiently transmit high-frequency signals while minimizing width and preventing crosstalk, as existing designs often increase in width with multiple signal transmission portions, making miniaturization difficult.

Innovation Solution

A multilayer board design featuring a laminated insulating body with multiple insulating base material layers, three or more signal conductors, and ground conductors that sandwich the signal conductors, including a parallel extending portion with overlapping signal conductors and varying ground conductor intervals to reduce width and crosstalk, along with interlayer connection conductors and auxiliary ground conductors to enhance isolation and reduce radiation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If multiple signal transmission portions are arranged in the width direction, then the signal transmission capacity is improved, but the width of the multilayer board increases

Engineering Contradiction:
Improvesignal transmission capacityVSAvoidwidth of multilayer board
Core Design Contradiction:
ProductivityVSArea of stationary object

Solution Approach 1:

The patent transitions from arranging signal transmission portions only in the width direction to utilizing both the width direction and the lamination direction (thickness direction) by stacking insulating base material layers. This dimensional change allows multiple signal conductors to be arranged in the lamination direction across different layers, thereby increasing signal transmission capacity without proportionally increasing the board width.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent employs a laminated structure where multiple insulating base material layers are stacked, with signal conductors and ground conductors nested within these layers. This nesting approach allows compact arrangement of multiple signal transmission portions in the thickness direction, reducing the required width while maintaining high signal transmission capacity.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Area of stationary object

If signal conductors are arranged closely to reduce width, then the board width is reduced, but crosstalk between signal conductors increases

Engineering Contradiction:
Improvewidth of multilayer boardVSAvoidcrosstalk between signal conductors
Core Design Contradiction:
Area of stationary objectVSObject-generated harmful factors

Solution Approach 1:

The patent introduces ground conductors as intermediary elements positioned between adjacent signal conductors in the lamination direction. These ground conductors act as shielding barriers that electrically isolate the signal conductors, preventing electromagnetic coupling and crosstalk. This mediator approach allows signal conductors to be arranged closely in the width direction without increasing crosstalk, as the ground conductors in the lamination direction provide effective isolation.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent applies different conductor arrangements in different spatial regions: signal conductors are arranged closely in the width direction for compactness, while ground conductors are positioned in the lamination direction to provide localized shielding. This creates different functional zones within the same structure, allowing close spacing without crosstalk by providing targeted isolation where needed.

Inventive Principle:
Principle #3Local quality

3Object-generated harmful factors

If ground conductor interval is reduced to improve isolation, then crosstalk is reduced, but the complexity of the structure increases

Engineering Contradiction:
Improvecrosstalk between signal conductorsVSAvoidstructure complexity
Core Design Contradiction:
Object-generated harmful factorsVSDevice complexity

Solution Approach 1:

The patent reduces structure complexity by utilizing the lamination direction (third dimension) for ground conductor arrangement instead of increasing the number of ground conductors in the width direction. By positioning ground conductors in the lamination direction across stacked layers, effective isolation is achieved with fewer conductors overall, avoiding the complexity that would result from dense in-plane grounding structures.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS11659658B2Multilayer board
Publication Date: 2023.05.23 MURATA MFG CO LTD
  • US11659658B2 patent drawing
  • US11659658B2 patent drawing
  • US11659658B2 patent drawing

AI summary

A multilayer board includes a laminated insulating body, signal conductors inside the laminated insulating body and extending in a transmission direction, and ground conductors sandwiching each of the signal conductors in a lamination direction via the insulating base material layers. The multilayer board includes a parallel extending portion in which the signal conductors extend parallel and that includes signal conductors arranged separately from each other in a direction orthogonal to the transmission direction in a planar view in the lamination direction, and a signal conductor overlapping with the signal conductor in a planar view in the lamination direction and arranged separately from the signal conductor in the lamination direction. The parallel extending portion includes first and second regions arranged separately in a direction orthogonal to the transmission direction in a planar view in the lamination direction.