Multilayer Component Bond Coat Thickness Assessment
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Solution Overview
Problem
Current non-destructive testing methods for multilayer components, such as those with ceramic layers on metallic substrates, lack the ability to provide quantitative data on lifetime-relevant properties like bond coat depletion, and cannot be performed on-site, leading to the destruction of components for assessment.
Innovation Solution
A method involving creating a predefined opening in the multilayer component using a digital microscope to calculate the bond coat thickness, which includes drilling and optionally increasing contrast through polishing and etching, allowing for on-site analysis and repair of the component.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional non-destructive testing methods (thermography) are used to assess multilayer components, then the component remains intact, but quantitative data on bond coat depletion and layer thickness cannot be obtained
Solution Approach 1:
The method creates a localized opening (segment) in the multilayer component to expose the bond coat and substrate interface. This segmented approach allows quantitative measurement of bond coat thickness and depletion at the opening location while leaving the rest of the component intact for continued service
Solution Approach 2:
The assessment is performed locally at the opening rather than requiring complete destruction of the component. The opening provides localized access to measure bond coat properties, enabling condition-based repair decisions without sacrificing the entire component
2Measurement precision
If destructive testing (cut up) is performed to obtain quantitative data on bond coat depletion, then measurement precision is improved, but the component is destroyed and must be replaced
Solution Approach 1:
Instead of completely destroying the component through cut-up, the method creates a small localized opening that provides access to the bond coat and substrate. This segmented approach yields quantitative measurement data while preserving the majority of the component for reuse after repair
Solution Approach 2:
The method enables recovery of the component by obtaining quantitative assessment data through a minimal opening. The component can then be repaired (bond coat replenishment) and returned to service, avoiding complete discarding that would result from traditional destructive testing
3Reliability
If conventional non-destructive testing is used, then the component remains usable, but on-site assessment capability is limited
Solution Approach 1:
The method performs preliminary assessment by creating an opening and measuring bond coat thickness and depletion before making final repair decisions. This preliminary action enables on-site evaluation of component condition, allowing informed decisions about whether repair is feasible and what scope of repair is needed
4Measurement precision
If an opening is created in the multilayer component for assessment, then quantitative measurement capability is improved, but the component structure is modified
Solution Approach 1:
The opening created for assessment is subsequently repaired through bond coat replenishment and sealing processes. This recovery process restores the component structure, maintaining stability and integrity while having obtained the necessary quantitative measurement data
Solution Approach 2:
The method accounts for the structural modification by planning for subsequent repair actions. The opening is treated as a temporary access point that will be restored, cushioning against potential structural concerns by ensuring proper repair procedures are followed
Data Source
AI summary
An automated system is provided. The system includes: a manipulator coupled to: an opening forming device configured to create an opening having a predefined geometry partially into a multilayer component at a selected location on a surface of the multilayer component, where the multilayer component includes a plurality of material layers including at least a substrate and a bond coat, and where the opening exposes each of the plurality of material layers; and an imaging device configured to create an image of the exposed plurality of material layers in the opening; and a processor configured to calculate at least a thickness of the bond coat of the exposed plurality of material layers from the image and based on the predefined geometry of the opening. Methods of using the system to analyze layer thickness of a multilayer component and repair a multilayer component are also provided.


