Multilayer Bonding Composition for Low-Expansion Adhesive Layers
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Solution Overview
Problem
The method of bonding substrates with an adhesive for multilayer structures in electronic devices faces challenges due to strain caused by differences in thermal expansion coefficients, leading to warpage or separation, and existing solutions compromise between thermal expansion and adhesive strength.
Innovation Solution
A composition comprising compounds with Si—O bonds, cationic functional groups, and cyclic structures is used to form a layer with a controlled ratio of nitrogen atoms, which reacts to create a cured product with low thermal expansion and high adhesive strength, thereby reducing strain and enhancing bonding reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If an adhesive is used to bond substrates at lower temperature, then bonding temperature is reduced, but thermal expansion difference causes warpage or separation
Solution Approach 1:
The patent modifies the chemical composition parameters of the adhesive by incorporating specific compounds (A), (B), and (C) with defined molecular structures and ratios. This changes the thermal expansion characteristics of the adhesive to better match the substrate, reducing thermal stress while maintaining low bonding temperature capability
Solution Approach 2:
The patent creates a composite adhesive system combining multiple compounds with different functional properties. Compound (A) provides adhesion, compound (B) provides crosslinking, and compound (C) modifies thermal properties. This composite approach allows simultaneous optimization of bonding strength and thermal expansion matching
2Stability of the object's composition
If inorganic filler is added to lower thermal expansion coefficient, then thermal expansion is reduced, but adhesion strength is lowered
Solution Approach 1:
Instead of adding inorganic fillers, the patent changes the chemical composition parameters by incorporating compound (C) with a cyclic structure and primary nitrogen atom. This organic modification achieves thermal expansion control without the adhesion penalty of inorganic fillers
Solution Approach 2:
The patent introduces compound (C) with specific local molecular structure (cyclic structure with primary nitrogen atom) that provides thermal expansion control at the molecular level, allowing the adhesive to maintain both low thermal expansion and high adhesion strength through localized structural modification
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves a balance between low thermal expansion and strong adhesive properties, improving the reliability of multilayer bodies by minimizing strain and ensuring robust bonding between substrates.
Implementation Method 1
a compound (A), having an Si—O bond and a cationic functional group that includes at least one selected from the group consisting of a primary nitrogen atom and a secondary nitrogen atom; a compound (B), having at least three —C(═O)OX groups
Implementation Method 2
the layer comprising a reaction product of: a compound (A)... a compound (B)... and a compound (C)
Implementation Method 3
there are concerns that strain stemming from a difference in the thermal expansion coefficients of an adhesive and a substrate may cause warpage or separation of the substrates
Data Source
AI summary
A composition includes: a compound (A), having an Si—O bond and a cationic functional group that includes at least one selected from the group consisting of a primary nitrogen atom and a secondary nitrogen atom; a compound (B), having at least three —C(═O)OX groups, wherein X is a hydrogen atom or an alkyl group with a carbon number of from 1 to 6, and from one to six of the —C(═O)OX groups is a —C(═O)OH group; and a compound (C), having a cyclic structure and at least one primary nitrogen atom that is directly bonded to the cyclic structure, the composition having a percentage of the primary and the secondary nitrogen atoms in the compound (A), with respect to a total amount of the primary and the secondary nitrogen atoms in the compound (A) and the primary nitrogen atom in the compound (C), of from 3 mol % to 95 mol %.