Multilayer Bus Board Molded Frame Design
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Solution Overview
Problem
Current multilayer bus board manufacturing processes are time-consuming, costly, and restrictive in terms of volume production, with limitations in heat dissipation, feature addition, and electrical efficiency due to the use of epoxy-based dielectric coatings and lamination processes, which hinder high-volume production and compact, efficient interconnection of subassemblies in high-power switching circuits.
Innovation Solution
A multilayer bus board design featuring a molded frame that securely holds conductive and dielectric layers together without adhesives or lamination, allowing for thin dielectric sheets, improved heat dissipation, and integration of features like topography and insulated pass-through holes, enabling efficient high-volume production and reduced inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If epoxy-based dielectric coatings and lamination processes are used, then mechanical strength and insulation are achieved, but production time increases and heat dissipation is restricted
Solution Approach 1:
The patent extracts and removes the epoxy-based dielectric coating and lamination process from the manufacturing method. Instead, it uses a molded frame structure that mechanically holds conductive layers together without requiring epoxy coating or lamination, thereby eliminating the time-consuming lamination step while maintaining structural integrity
Solution Approach 2:
The patent replaces the chemical bonding mechanism (epoxy lamination) with a mechanical holding system (molded frame). The molded frame physically secures multiple conductive layers in place through mechanical means, substituting the need for epoxy-based adhesive bonding and high-temperature lamination processes
2Strength
If epoxy-based dielectric coatings are used, then mechanical strength is achieved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent extracts and removes the epoxy-based dielectric coating that restricts heat dissipation. By eliminating this thermal barrier, the design allows for improved heat dissipation from the conductive layers while maintaining mechanical strength through the molded frame structure
Solution Approach 2:
The patent applies local quality by providing mechanical support and insulation only where needed through the molded frame structure, rather than covering entire surfaces with epoxy coating. This allows regions requiring heat dissipation to remain exposed while maintaining structural integrity at critical points
3Reliability
If insulating sleeves are placed in openings, then electrical insulation is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent merges the electrical insulation function into the molded frame structure itself. The molded frame integrates support, insulation, and mechanical holding functions into a single component, eliminating the need for separate insulating sleeves and reducing assembly steps
Solution Approach 2:
The molded frame serves multiple functions simultaneously: it provides mechanical support for conductive layers, electrical insulation between layers, structural containment, and positioning features. This multi-functionality eliminates the need for separate insulating components
4Stability of the object's composition
If lamination process is used, then layered assembly is achieved, but production speed decreases
Solution Approach 1:
The patent extracts and removes the lamination process from the manufacturing sequence. Multiple conductive layers are assembled and held together by the molded frame without requiring the time-consuming lamination step, enabling faster production while maintaining stable layered assembly
Solution Approach 2:
The molded frame is prepared in advance with integrated features for holding conductive layers. This preliminary preparation of the frame structure allows for rapid assembly of multiple layers without requiring post-assembly lamination processing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables faster, cost-effective high-volume production of multilayer bus boards with enhanced heat dissipation, reduced inductance, and improved mechanical and electrical efficiency, supporting high-power switching applications with compact, efficient interconnection of subassemblies.
Implementation Method 1
a dielectric layer (104) disposed between adjacent conductive layers (102)
Implementation Method 2
a molded frame (110) that mechanically holds the multilayer stacked assembly (108) and adjacent conductive layers (102) and the dielectric layers (104) and (106) in secure aligned stacked arrangement
Implementation Method 3
conductive plates or layers are insulated from adjacent conductive layers by a dielectric layer disposed therebetween
Data Source
Figure 1
Figure 2A~2B
Figure 2C
AI summary
A multilayer bus board comprising a multilayer stacked assembly including a plurality of electrically conductive first layers, and at least one second dielectric layer disposed between adjacent first layers; and a frame formed of a dielectric material, the frame encapsulating at least a portion of the multilayer stacked assembly and mechanically maintaining the first and second layers in secure aligned abutting relation.