Multilayer Capacitor Amorphous Dielectric Film Sintering
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Solution Overview
Problem
Existing multilayer capacitor manufacturing methods face challenges in increasing the effective volume ratio and ensuring moisture resistance reliability, as the sheet transfer method involves complex processes, leads to work defects, and limits the ability to simultaneously enhance capacitance and moisture resistance.
Innovation Solution
A multilayer capacitor design featuring a capacitor body with dielectric layers and internal electrodes exposed to surfaces, where an amorphous dielectric film is directly contacted with the electrodes, formed using a ceramic green sheet laminate and sintered to create a high-capacity capacitor with improved moisture resistance, achieved through a specific manufacturing process involving stripe-type electrode patterns and deposition of ultra-thin amorphous dielectric films.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the sheet transfer method is used to form dielectric sheets on opposing side surfaces, then moisture resistance is improved, but the process complexity increases and productivity decreases
Solution Approach 1:
The patent extracts the dielectric film formation process from the complex sheet transfer method and integrates it into the sintering process itself. The organic compound is incorporated into the ceramic green sheet before sintering, allowing the dielectric film to form in-situ on the internal electrodes during the sintering process, eliminating the need for separate sheet transfer and additional sintering steps.
Solution Approach 2:
The patent merges the dielectric film formation process with the main sintering process. By incorporating the organic compound into the ceramic green sheet formulation, both the capacitor body sintering and the protective dielectric film formation occur in a single sintering cycle, reducing process complexity and improving productivity while maintaining moisture resistance.
2Reliability
If the sheet transfer method is used with sintering process, then moisture resistance is improved, but the manufacturing process time increases
Solution Approach 1:
The patent combines the dielectric film formation and capacitor body sintering into a single integrated process step. The organic compound is present in the ceramic green sheet from the beginning, so when sintering occurs, both the ceramic body forms and the dielectric film deposits on the internal electrodes simultaneously, eliminating sequential processing time.
Solution Approach 2:
The patent performs preliminary action by incorporating the organic compound into the ceramic green sheet before sintering. This pre-positioning of the dielectric material ensures that during the single sintering process, the film forms automatically on the internal electrodes without requiring post-formation sintering steps.
3Quantity of substance
If different dielectric materials are used for dielectric layers and dielectric sheets, then capacity is improved, but process complexity and quality control difficulty increase
Solution Approach 1:
The patent applies local quality by using different materials in different locations within the same component. The bulk capacitor body uses high-k dielectric ceramic material for maximum capacitance, while the dielectric film formed on the internal electrodes uses an organic compound that provides superior moisture resistance and electrical insulation, with each material optimized for its specific functional role.
Solution Approach 2:
The patent changes the material parameter locally on the internal electrodes. Instead of using the same ceramic material throughout, an organic compound is introduced that transforms during sintering to form a dielectric film with different properties (better moisture resistance) than the bulk ceramic, allowing simultaneous optimization of capacitance and reliability.
4Reliability
If pressure is applied to the capacitor body during sheet transfer, then dielectric sheets are formed on surfaces, but work defects occur and productivity decreases
Solution Approach 1:
The patent removes the mechanical pressure application step from the dielectric film formation process. Instead of transferring sheets under pressure, the dielectric film forms in-situ during sintering through thermal decomposition and deposition of the organic compound, eliminating the source of work defects and production bottlenecks.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a high-capacity multilayer capacitor with enhanced moisture resistance reliability, overcoming the limitations of traditional methods by increasing the overlapping area of internal electrodes and ensuring electrical insulation while maintaining productivity.
Implementation Method 1
forming amorphous dielectric films on first and second surfaces of the capacitor body
Implementation Method 2
obtaining a capacitor body by sintering the separate laminate
Data Source
AI summary
A multilayer capacitor includes a capacitor body having a first surface and a second surface opposing each other, and a third surface and a fourth surface opposing each other while being connected to the first surface and the second surface. The multilayer capacitor includes dielectric layers, and a first internal electrode and a second internal electrode disposed alternately with the dielectric layers interposed therebetween and being exposed to the first and second surfaces, respectively; and an amorphous dielectric film disposed on at least the third and fourth surfaces of the capacitor body. The amorphous dielectric film may be in direct contact with the first and second internal electrodes.