Multilayer Ceramic Capacitor Asymmetric Cover Design
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Solution Overview
Problem
Multilayer ceramic capacitors face challenges in maintaining moisture resistance reliability due to the reduction in side margin portion thickness, leading to moisture penetration and decreased insulation resistance, especially in miniaturized chip sizes.
Innovation Solution
The design includes a thicker lower cover portion compared to the upper cover portion, with specific ratios of side margin portion width to cover portion thickness and body thickness to improve moisture resistance reliability while maintaining high capacitance, achieved by controlling the thickness and dimensions of the cover portions and side margin portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the side margin portion thickness is reduced to achieve miniaturization and high capacitance, then the effective electrode area is maximized, but moisture resistance reliability deteriorates due to moisture penetration
Solution Approach 1:
The patent applies local quality by creating asymmetric cover portions with different thicknesses. The lower cover portion has a greater thickness than the upper cover portion, providing enhanced moisture protection at the critical lower region where moisture penetration is most likely to occur. This localized reinforcement resolves the contradiction by maintaining miniaturization while protecting against moisture at the most vulnerable location.
Solution Approach 2:
The patent employs asymmetry by designing the lower cover portion to be thicker than the upper cover portion. This asymmetric structure addresses the moisture resistance issue preferentially at the lower side margin portion, which is more susceptible to moisture penetration. The asymmetric design allows the component to maintain small overall dimensions while providing enhanced protection where it is most needed.
2Volume of moving object
If the side margin portion thickness is reduced to achieve miniaturization, then the chip size is minimized, but insulation resistance decreases due to moisture penetration
Solution Approach 1:
The patent applies local quality by concentrating the moisture protection function in the lower cover portion, which has greater thickness. This localized reinforcement at the critical lower region prevents moisture penetration that would otherwise compromise insulation resistance, allowing the chip to maintain minimal size while protecting the insulation properties at the most vulnerable location.
3Reliability
If the side margin portion thickness is increased to improve moisture resistance, then moisture penetration is prevented, but capacitance per unit volume decreases
Solution Approach 1:
The patent applies local quality by providing moisture protection selectively at the lower cover portion rather than uniformly throughout. The lower cover portion has greater thickness for moisture resistance, while the upper cover portion maintains smaller dimensions. This localized approach prevents moisture penetration at the critical region without unnecessarily reducing the effective electrode area, thereby maintaining capacitance per unit volume.
Solution Approach 2:
The patent applies partial action by providing enhanced thickness only where it is most needed for moisture protection (the lower cover portion). Rather than increasing the thickness of the entire side margin portion uniformly, the design concentrates the protective function at the lower region, achieving adequate moisture resistance without excessive material usage that would reduce capacitance per unit volume.
Data Source
AI summary
A multilayer electronic component includes a body including dielectric layers and internal electrodes. The internal electrodes are exposed to fifth and sixth surfaces of the body, and first ends thereof are respectively exposed to third or fourth surfaces of the body. First and second side margin portions are respectively disposed on the fifth and sixth surfaces. The body includes an active portion, and upper and lower cover portions disposed respectively on a first surface and a second surface of the active portion in a first direction. The ratio of a dimension of the lower cover portion in the first direction C to a dimension of the first side margin portion in the third direction A, C/A≥2.6, C/T is 0.080, where T is a dimension of the body in the first direction, and D<C where D is the dimension of the body in the first direction.