Multilayer Capacitor Reinforcing Pattern to Prevent Bending Cracks
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Solution Overview
Problem
Existing multilayer ceramic capacitors are prone to bending cracks and steps due to the vulnerability of conventional dummy patterns, especially when formed in multiple layers, which compromise their structural integrity.
Innovation Solution
A multilayer electronic component design featuring a reinforcing portion with alternating conductive patterns in a grid shape, spaced apart from the component surfaces, and connected to external electrodes, which alleviates steps and prevents bending cracks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If dummy patterns are formed on upper and lower surfaces to improve bending strength, then bending strength is improved, but the dummy patterns are vulnerable to bending cracks due to straight end shapes
Solution Approach 1:
The dummy pattern's end shape is changed from straight to curved, specifically with a curvature radius R of 5 µm to 50 µm. This curved end shape prevents stress concentration that occurs at sharp corners, thereby eliminating the vulnerability to bending cracks while maintaining the bending strength improvement.
Solution Approach 2:
The invention changes the geometric parameters of the dummy pattern, specifically the end shape curvature radius (R = 5 µm to 50 µm) and the pattern dimensions (width W1 = 5 µm to 50 µm, length L1 = 10 µm to 100 µm). These parameter changes optimize both the strength and crack resistance of the dummy pattern.
2Strength
If dummy patterns are formed of multiple layers to sufficiently improve strength, then bending strength is improved, but steps occur due to overlap between dummy patterns in stacking direction
Solution Approach 1:
Instead of stacking dummy patterns in the vertical direction (first direction), the invention arranges them in the horizontal direction (second direction) with alternating orientations. This dimensional change eliminates the step formation problem caused by vertical stacking while maintaining the strength reinforcement effect.
Solution Approach 2:
The reinforcing structure is divided into multiple discrete dummy patterns arranged in alternating orientations rather than forming a continuous stacked structure. This segmentation approach prevents step formation while distributing the reinforcement function across multiple elements.
3Ease of manufacture
If conventional dummy patterns with straight ends are used, then manufacturing is simple, but bending cracks occur at the straight ends
Solution Approach 1:
The dummy pattern ends are designed with a curved shape having a specific curvature radius (R = 5 µm to 50 µm). This curvature can be easily formed using standard printing and sintering processes, maintaining manufacturing simplicity while eliminating bending crack vulnerability at the ends.
Data Source
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AI summary
In a multilayer electronic component according to an embodiment of the present disclosure, a step of the multilayer electronic component may be alleviated by adjusting the shape of the reinforcing pattern included in the reinforcing portion disposed on at least one of one surface and the other surface of the capacitance formation portion in the first direction, and the occurrence of bending cracks may be suppressed.