Multilayer Capacitor Coating for Damp Proof Reliability
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Solution Overview
Problem
Multilayer capacitors face challenges in damp proof reliability due to the penetration of plating solutions or water, especially with reduced electrode thickness, which compromises their performance and reliability.
Innovation Solution
A multilayer electronic component is designed with a multilayer coating structure on its surface, comprising an internal aluminum oxide layer and an external silicon dioxide or titanium dioxide layer, with a nickel and tin plating layer configuration, and a specific thickness range of 10 nm to 200 nm to enhance damp proof reliability, and a manufacturing method involving atomic layer deposition and plating processes to form these layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If electrode thickness is reduced to achieve high capacity with small dimensions, then the volume ratio of dielectric substance is increased, but damp proof reliability deteriorates due to penetration of plating solution or water
Solution Approach 1:
The coating layer is divided into multiple sub-layers with different materials and functions. The first coating layer (Al2O3) provides adhesion to the capacitor body, while the second coating layer (SiO2 or TiO2) provides the primary barrier against moisture and plating solution penetration. This segmentation allows each layer to optimize its specific function, achieving both compact dimensions and high damp proof reliability.
Solution Approach 2:
The patent uses a composite coating structure combining different materials (Al2O3 and SiO2/TiO2) with complementary properties. Al2O3 provides excellent adhesion and chemical stability, while SiO2 or TiO2 provides superior moisture barrier properties. This composite approach creates a synergistic effect that prevents penetration of plating solution and water, solving the reliability issue while maintaining reduced electrode thickness.
2Reliability
If a multilayer coating structure is added to enhance damp proof reliability, then protection against water and plating solution penetration is improved, but device complexity increases
Solution Approach 1:
The coating structure is applied locally and selectively on the capacitor body surface, particularly on the external electrodes where penetration risk is highest. The first coating layer of Al2O3 is formed with a thickness of 1-10 nm for adhesion, and the second coating layer of SiO2 or TiO2 is formed with a thickness of 10-100 nm for barrier protection. This localized application with optimized local thickness achieves high damp proof reliability without unnecessarily increasing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly enhances damp proof reliability and plating yield, maintaining operational integrity by preventing water and plating solution penetration, while optimizing processing time and reducing failures.
Implementation Method 1
forming a multilayer coating layer by coating and drying a thin film on a circumference of the sintered body using an atomic layer deposition (ALD) process
Implementation Method 2
forming first and second plating layers on surfaces of the first and second conductive layers, respectively using a plating process
Data Source
AI summary
A multilayer electronic component for enhancing damp proof reliability includes: a capacitor body including a plurality of dielectric layers, and first and second internal electrodes, alternately disposed across the dielectric layers to expose one end of the first and second electrodes through third and fourth surfaces of the capacitor body; first and second conductive layers disposed on the third and fourth surfaces of the capacitor body and connected to the first and second internal electrodes, respectively; first and second plating layers covering surfaces of the first and second conductive layers; and a plurality of coating layers configured in a multilayer structure on a surface of the capacitor body to expose the first and second plating layers and having an entire thickness of 10 nm to 200 nm.