Multilayer Capacitor Segmented Columnar Electrodes ESL Reduction
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Solution Overview
Problem
Conventional multilayer capacitors face challenges in reducing equivalent serial inductance (ESL) while maintaining internal electrode layer areas, leading to increased connection resistances and production difficulties due to the need for elongated through holes, which affects their ability to handle high-speed CPUs and stabilize power supplies effectively.
Innovation Solution
A multilayer capacitor design featuring first and second external electrodes on one end face, with lead and interlayer connection columnar electrodes of varying cross-sectional areas, allowing for reduced connection resistances and easier production by eliminating the need for elongated through holes, thereby maintaining low ESL and electrostatic capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a larger number of elongated through holes are formed to connect external electrodes to internal electrode layers, then the ESL is reduced, but the electrode areas of the internal electrode layers are reduced and connection resistances increase
Solution Approach 1:
The through holes are segmented into two distinct types: lead through holes for external electrode connections and interlayer through holes for internal electrode layer connections. This segmentation allows each type of through hole to be optimized independently, with interlayer through holes having larger cross-sectional areas to maintain electrode areas while lead through holes being positioned to achieve low ESL.
Solution Approach 2:
Different cross-sectional areas are assigned to different types of through holes based on their specific functions. Interlayer through holes have larger cross-sectional areas to minimize connection resistances and maintain electrode areas, while lead through holes have appropriate sizes for external connections. This local differentiation resolves the contradiction between ESL reduction and electrode area maintenance.
2Reliability
If a larger number of elongated through holes are formed inside the multilayer capacitor, then the ESL is reduced, but the production becomes difficult and costs increase
Solution Approach 1:
The through holes are divided into two categories formed at different stages: lead through holes formed during initial production and interlayer through holes formed subsequently. This segmented approach simplifies the manufacturing process compared to forming all through holes simultaneously, as each type can be optimized for its specific formation stage and function.
Solution Approach 2:
Lead through holes are formed and connected to external electrodes during the initial production stage, while interlayer through holes are formed later to connect internal electrode layers. This preliminary action allows the manufacturing process to be broken into manageable stages, reducing overall production difficulty while achieving low ESL.
Data Source
AI summary
A multilayer capacitor comprised of dielectric layers stacked to form a device body in which a plurality of first internal electrode layers and a plurality of second internal electrode layers formed in planar shapes are alternately arranged while being separated through the dielectric layers, wherein the first external electrodes and second external electrodes are arranged at only a first end face of the device body, lead use columnar electrodes connect the internal electrode layers stacked close to the first end face of the device body and external electrodes, interlayer connection use columnar electrodes connect the internal electrode layers stacked at the inside of the device body, and the interlayer connection use columnar electrodes have cross-sectional areas larger than the cross-sectional areas of the lead use columnar electrodes.