Multilayer Capacitor Electrode Layout for Lower Cutting Stress
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Solution Overview
Problem
Existing multilayered capacitors face issues with non-uniform thickness of internal electrodes, leading to breakage, poor contact with external electrodes, and reduced capacitance, particularly when manufactured using screen printing methods.
Innovation Solution
The use of sputtering method to form internal electrodes with thinner lead portions and capacitance forming portions, where lead portions have gradually decreasing widths towards the external electrodes, reducing the connection area and distributing cutting stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If internal electrodes are manufactured by screen printing method, then manufacturing process is simple, but electrode thickness is not uniform and cannot achieve small thickness below predetermined value
Solution Approach 1:
The patent transitions from screen printing method to sputtering method, changing the manufacturing process parameters to achieve uniform electrode thickness and enable thickness control below predetermined values while maintaining manufacturing feasibility
2Volume of moving object
If internal electrode thickness is reduced for ultra-small capacitor size, then capacitor size decreases, but cutting stress increases and electrode breakage occurs
Solution Approach 1:
The patent applies different thicknesses to different portions of the internal electrode, with the first lead portion having a first thickness and the second lead portion having a second thickness greater than the first thickness, to locally reinforce areas subject to cutting stress while maintaining overall small capacitor size
Solution Approach 2:
The patent uses a composite structure with dielectric layers and conductive layers of different materials and thicknesses, where the conductive layer includes multiple portions with different thicknesses to balance miniaturization and mechanical strength requirements
3Ease of manufacture
If internal electrode thickness is non-uniform, then manufacturing is easier, but contact between internal electrode and external electrode deteriorates and capacitance decreases
Solution Approach 1:
The patent employs sputtering method with controlled parameters to deposit conductive layers with specific thickness profiles, ensuring uniform and adequate thickness at critical contact regions while maintaining manufacturing efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration lowers cutting stress, prevents electrode breakage, improves contact with external electrodes, and enhances capacitance, thereby increasing product reliability and reducing defects from plating solution penetration.
Implementation Method 1
there is a need for the development of internal electrodes by using a sputtering method
Data Source
AI summary
A multilayered capacitor includes: a body including a first internal electrode and a second internal electrode disposed in a first direction while having a dielectric layer therebetween; and a first external electrode and a second external electrode respectively disposed at ends of the body in a second direction. The first internal electrode includes a first capacitance forming portion and a plurality of first lead portions extending from the first capacitance forming portion to connect to the first external electrode. The second internal electrode includes a second capacitance forming portion overlapping the first capacitance forming portion in the first direction and a plurality of second lead portions extending from the second capacitance forming portion to connect to the second external electrode. For a thickness in the first direction, one of the plurality of the first lead portion has a thickness smaller than a thickness of the first capacitance forming portion.