Multilayer Capacitor Differential Sintering
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Solution Overview
Problem
Existing multilayer capacitors face challenges in miniaturization and increased capacitance due to limitations in forming internal electrodes and dielectric layers at low thicknesses, leading to issues like electrode breakage and short-circuit defects.
Innovation Solution
The solution involves using constrained sintering technology to control shrinkage in the sintering process, where the first internal electrode is sintered at a lower temperature than the second internal electrode, allowing for accelerated shrinkage in the thickness direction, and utilizing conductive pastes with different sintering temperatures and ceramic content to achieve thinner dielectric layers and internal electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of internal electrodes and dielectric layers is reduced to achieve miniaturization, then the size of the multilayer capacitor is reduced, but electrode breakage and short-circuit defects increase
Solution Approach 1:
The patent applies parameter changes by using conductive pastes with different sintering temperatures for different internal electrodes. The first internal electrode uses paste with lower sintering temperature (e.g., 900-1000°C) while the second uses higher temperature paste (e.g., 1000-1100°C). This differential sintering approach allows each electrode to achieve optimal density and mechanical strength at its specific thickness, preventing breakage and short-circuits even when overall dimensions are reduced.
2Quantity of substance
If the thickness of internal electrodes and dielectric layers is reduced to increase capacitance density, then the capacitance per volume is increased, but manufacturing precision becomes more difficult to maintain
Solution Approach 1:
The patent implements local quality by tailoring the conductive paste composition and sintering temperature to the specific requirements of each internal electrode position. The first internal electrode (typically closer to external electrodes) uses paste with lower sintering temperature and different ceramic particle size distribution compared to the second internal electrode. This localized optimization ensures each electrode achieves the required thickness precision and capacitance density without compromising overall manufacturing reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively miniaturizes the multilayer capacitor while maintaining reliability and reducing defect rates, achieving a thickness ratio of 1.05≤t1/t2≤1.6 for internal electrodes and 0.14 to 0.95 μm thickness for dielectric layers, enhancing capacitance and miniaturization.
Implementation Method 1
constrained sintering technology to control shrinkage in the sintering process, where the first internal electrode is sintered at a lower temperature than the second internal electrode, allowing for accelerated shrinkage in the thickness direction
Implementation Method 2
control shrinkage in the sintering process, where the first internal electrode is sintered at a lower temperature than the second internal electrode, allowing for accelerated shrinkage in the thickness direction
Data Source
AI summary
A multilayer capacitor includes: a body including dielectric layers and internal electrodes alternately disposed therein; and external electrodes disposed on the body and connected to the internal electrodes. The internal electrodes include a first internal electrode and a second internal electrode. A thickness of the second internal electrode is less than a thickness of the first internal electrode, and an area fraction of ceramics included in the first internal electrode with respect to the first internal electrode is greater than that of ceramics included in the second internal electrode with respect to the second internal electrode.