Multilayer Capacitor Electrode Printing for Size and Reliability
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Solution Overview
Problem
Existing multilayer capacitors face challenges in reducing size while maintaining performance, including capacitance, manufacturing costs, reliability, withstand voltage, and mounting efficiency.
Innovation Solution
A method of manufacturing a multilayer capacitor involves preparing a guide frame, forming dielectric layers between its surfaces, forming internal electrodes using inkjet printing, and separating the guide frame from the dielectric and internal electrode layers. The capacitor design includes alternately laminated internal electrodes and dielectric layers with specific thicknesses and air gaps to optimize performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of multilayer capacitor is reduced, then mounting efficiency and device integration are improved, but manufacturing precision and reliability become more difficult to maintain
Solution Approach 1:
The patent changes the thickness parameter of internal electrodes to 0.25 μm or less, which is a significant reduction from conventional thicknesses. This parameter change enables smaller capacitor size while the inkjet printing method maintains manufacturing precision through controlled material deposition. The extreme thinness of electrodes is achieved by adjusting printing parameters and material viscosity to control the deposited layer thickness accurately.
Solution Approach 2:
The patent replaces conventional mechanical printing methods (such as screen printing) with inkjet printing technology. This substitution allows for precise digital control of electrode thickness and pattern formation, enabling manufacturing of ultra-thin electrodes (0.25 μm or less) with high precision. The inkjet system uses non-contact material deposition, eliminating mechanical constraints that limit electrode thickness control in traditional methods.
2Volume of moving object
If internal electrode thickness is reduced to 0.25 μm or less, then capacitor size is reduced, but manufacturing complexity and difficulty increase
Solution Approach 1:
The patent employs inkjet printing technology to replace conventional mechanical printing methods. This substitution enables precise control of electrode thickness at 0.25 μm or less through digital parameter adjustment rather than mechanical modification. The inkjet system can accurately deposit ultra-thin conductive paste layers by controlling droplet size, placement frequency, and material formulation, thereby reducing electrode volume without proportionally increasing manufacturing complexity.
Solution Approach 2:
The patent utilizes parameter changes in the inkjet printing process, including material viscosity, printing speed, droplet size, and layering strategy, to achieve consistent ultra-thin electrode deposition. By optimizing these parameters, the system can manufacture electrodes with thickness of 0.25 μm or less while maintaining production efficiency and reducing process complexity compared to attempting mechanical thinning or other conventional approaches.
3Reliability
If air gaps are introduced between electrodes and external electrodes, then reliability is improved, but device volume increases
Solution Approach 1:
The patent applies local quality by introducing air gaps specifically in regions where electrical insulation is critical, such as between internal electrodes and external electrodes. Rather than uniformly increasing spacing throughout the device, the air gaps are strategically positioned only where needed for reliability, minimizing the overall volume impact. This localized approach maintains high electrical insulation reliability while keeping the capacitor compact.
Solution Approach 2:
The patent utilizes the air gap as a composite insulating structure between the conductive internal electrodes and external electrodes. The air gap acts as a natural insulator with excellent dielectric properties, providing reliable electrical isolation without requiring additional insulating materials that would increase volume. This composite structure of conductor-insulator-conductor achieves high reliability while maintaining compact dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The approach enables the creation of a multilayer capacitor with reduced size while maintaining or improving performance metrics such as capacitance, reliability, and mounting efficiency, thereby addressing the challenges of miniaturization and cost-effectiveness.
Implementation Method 1
forming at least one internal electrode on an upper surface of the at least one dielectric layer between at least two surfaces of the guide frame using an inkjet printing method
Data Source
AI summary
A method of manufacturing a multilayer capacitor includes preparing a guide frame, forming at least one dielectric layer between at least two surfaces of the guide frame such that at least a portion of each side surface of the at least one dielectric layer is in contact with the at least two surfaces, forming at least one internal electrode on an upper surface of the at least one dielectric layer between at least two surfaces of the guide frame using an inkjet printing method, and separating at least two surfaces of the guide frame from the at least one dielectric layer.