Multilayer Capacitor Electrode Composition for Thin-Layer Reliability
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Solution Overview
Problem
Multilayer ceramic capacitors face challenges in achieving higher capacitance per unit volume, reliability, and high-temperature load life due to issues like internal electrode agglomeration, disconnection, and non-uniform thickness, especially in applications requiring smaller sizes and increased connectivity.
Innovation Solution
The multilayer electronic component incorporates specific indium (In) content ratios relative to titanium (Ti) and nickel (Ni) in the dielectric and internal electrodes, respectively, along with controlled thickness variations and connectivity improvements, enhancing bonding strength and electron movement barriers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the thickness of internal electrodes is reduced to increase the number of stacked layers, then capacitance per unit volume increases, but internal electrode agglomeration and disconnection occur due to lower sintering-shrinkage initiation temperature
Solution Approach 1:
The patent modifies the chemical composition parameters of the internal electrode material by adding specific metal elements (such as Cu, Ag, Pd, Pt, or Al) to the conventional Ni powder. This changes the sintering characteristics and raises the sintering-shrinkage initiation temperature, allowing thin internal electrodes to maintain structural integrity during sintering without agglomeration or disconnection.
Solution Approach 2:
The patent creates a composite internal electrode material by combining Ni powder with other metal powders (Cu, Ag, Pd, Pt, or Al). This composite structure leverages the properties of each metal to achieve both low resistivity and improved sintering behavior, preventing agglomeration and disconnection while maintaining thin electrode thickness.
2Productivity
If fine-grained metal powder particles are used to reduce internal electrode thickness, then more layers can be stacked, but discrepancy in shrinkage behavior with dielectric layer increases causing internal electrode disconnection
Solution Approach 1:
The patent changes the sintering temperature parameter by modifying the internal electrode composition to raise the sintering-shrinkage initiation temperature. This ensures that the internal electrode and dielectric layer shrink at similar rates during sintering, maintaining uniform shrinkage behavior and preventing disconnection between layers.
3Quantity of substance
If internal electrode thickness is reduced to improve capacitance, then manufacturing precision becomes more difficult to maintain, but reliability requires higher connectivity and uniform thickness
Solution Approach 1:
The patent modifies the material composition parameters of the internal electrode to change its sintering characteristics. This allows thin internal electrodes to be formed with better thickness uniformity and reduced agglomeration, achieving both high capacitance and manufacturing precision simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves capacitance, reliability, and high-temperature load life by suppressing internal electrode agglomeration and disconnection, ensuring better connectivity and uniformity.
Implementation Method 1
An average content of indium (In) relative to titanium (Ti) satisfies 0.3 at % or more and 3.8 at % or less in a region of the dielectric layer that is spaced apart by 2 nm from an interface thereof with the internal electrode
Data Source
AI summary
A multilayer electronic component includes: a body including a dielectric layer and an internal electrode; and external electrodes disposed on the body. An average content of indium (In) relative to titanium (Ti) satisfies 0.3 at % or more and 3.8 at % or less in a region of the dielectric layer that is spaced apart by 2 nm from an interface thereof with the internal electrode.