Multilayer Capacitor Electrode Segmentation for Substrate Embedding

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Solution Overview

Problem

Existing multilayer capacitors lack consideration for embedded mounting in substrates and secure electrical connection to substrate wiring, leading to potential plating solution penetration that degrades electrical characteristics.

Innovation Solution

A multilayer capacitor design with a rectangular parallelepiped element body, alternately disposed internal electrodes, and terminal electrodes, featuring a unique configuration that reduces height and prevents plating solution penetration by controlling the thickness and placement of connection portions, allowing for secure embedding and connection to substrate wiring.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the multilayer capacitor is designed for conventional mounting, then the electrical connection is simple, but the capacitor cannot be securely embedded in substrate and plating solution may penetrate into element body

Engineering Contradiction:

Improveembeddability in substrateVSAvoidprotection against plating solution penetration

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The terminal electrode is divided into multiple segments: a first electrode portion on the principal surface, a second electrode portion on the first side surface, and connection portions linking them. This segmentation allows the capacitor to be securely embedded in the substrate while maintaining electrical connection and preventing plating solution penetration through the layered structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The electrical connection is established not only through the principal surface but also through the first side surface. The connection portions extend from the main electrode portion toward the second side surface, creating a three-dimensional connection path that prevents plating solution from reaching the internal electrodes even when embedded in substrate.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Reliability

If the connection portion extends long distance, then electrical connection is more secure, but ESL increases

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidESL (Equivalent Series Inductance)

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The thickness of the inner layer portion is specifically controlled to be smaller than the length of the connection portion in the third direction. This parameter optimization ensures that the connection portion is long enough to prevent plating solution penetration while keeping the inductance low by minimizing the path length through the dielectric material.

Inventive Principle:

Principle #35Parameter changes

3Reliability

If the inner layer portion is made thick, then plating solution penetration is prevented, but height increases and embedding becomes difficult

Engineering Contradiction:

Improveprotection against plating solution penetrationVSAvoidheight of element body

Core Design Contradiction:

ReliabilityVSLength of moving object

Solution Approach 1:

The thickness of the inner layer portion is optimized to be smaller than the length of the connection portion in the third direction. This allows the connection portion to extend far enough to prevent plating solution from reaching the internal electrodes while keeping the overall height of the capacitor compact for easy embedding in substrate.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

Instead of increasing height in the first direction, the connection portions extend in the third direction toward the second side surface. This dimensional redistribution allows protection against plating solution penetration without significantly increasing the overall height of the element body.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

4Ease of manufacture

If terminal electrodes are only on principal surface, then manufacturing is simple, but embedding and connection to substrate wiring is insecure

Engineering Contradiction:

Improveterminal electrode fabricationVSAvoidembeddability and connection reliability

Core Design Contradiction:

Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The terminal electrode structure is segmented into multiple portions located on different surfaces: the first electrode portion on the principal surface and the second electrode portion on the first side surface. This segmentation enables secure embedding in substrate while maintaining manufacturing feasibility through standard electrode formation processes.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The terminal electrode system serves multiple functions: providing electrical connection on the principal surface for conventional mounting, providing embedding capability through side surface portions, and preventing plating solution penetration through the distributed connection portions. This multi-functionality achieves both ease of manufacture and adaptability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS10008329B2Multilayer capacitor having first internal electrodes and second internal electrodes alternately disposed

Publication Date: 2018.06.26 TDK CORP

AI summary

A length in a third direction of a first connection portion is smaller than a length in the third direction of a first main electrode portion. A length in the third direction of a second connection portion is smaller than a length in the third direction of a second main electrode portion. A thickness in a first direction of an inner layer portion is smaller than each of the length in the third direction of the first connection portion and the length in the third direction of the second connection portion and smaller than each of a gap from a second side surface to the first connection portion in the third direction and a gap from the second side surface to the second connection portion in the third direction. The second side surfaces oppose each other in the third direction perpendicular to the first direction.