Multilayer Solid Aluminum Capacitor With Embedded Flat Lead Frames
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Solution Overview
Problem
Conventional multilayer capacitors face challenges in achieving both compact size and high capacitance due to the limitations of the two-stage bending process, which can cause mechanical stress and compromise the laminated structure, leading to cracks and device failure.
Innovation Solution
Embedding substrate-based flat positive and negative lead frames into the capacitor casing eliminates the need for bending, allowing for more electrode sheets to be stacked and maximizing the contact area between the lead frames and the multilayer core, resulting in a thin and high-capacitance design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the capacitor body is made excessively thin to satisfy thin-profile demands, then the profile thickness is reduced, but mechanical stress during the bending process may crush the laminated structure, leading to cracks and device failure
Solution Approach 1:
Instead of bending the terminals after stacking (conventional approach), this patent inverts the sequence by embedding flat lead frames into the casing bottom before stacking the multilayer core. This reversal eliminates the bending operation that causes mechanical stress and structural damage in thin capacitors.
Solution Approach 2:
The lead frames are preliminarily embedded into the casing bottom before the multilayer core is stacked and assembled. This preliminary positioning ensures that the terminals are already in their final flat configuration, preventing any subsequent bending that would compromise the laminated structure of thin capacitors.
2Length of moving object
If the number of stacked electrode layers is reduced to satisfy thin-profile demands, then the capacitor thickness is reduced, but capacitance and impedance performance are compromised
Solution Approach 1:
This patent maximizes the utilization of the horizontal stacking area by embedding flat lead frames that extend across the bottom of the casing. This dimensional optimization allows more electrode layers to be stacked within the available horizontal space, achieving high capacitance without increasing thickness.
Solution Approach 2:
The flat lead frames serve multiple functions: they act as electrical terminals, provide structural support for the stacked multilayer core, and maximize the contact area for electrical connection. This multi-functionality enables the capacitor to achieve thin profile while maintaining high capacitance through efficient space utilization.
3Ease of operation
If the two-stage bending process is used to position terminals, then the terminals can be configured to face and adhere to the bottom of the casing, but the bending process inherently limits the thin-profile potential and increases device complexity
Solution Approach 1:
This patent extracts the bending operation from the manufacturing process by using flat lead frames that are embedded directly into the casing bottom in their final configuration. The bending step is completely removed, simplifying the manufacturing process while achieving the same terminal positioning function.
Solution Approach 2:
The mechanical bending process is replaced by a simpler embedding process where flat lead frames are positioned and fixed into the casing bottom. This substitution eliminates the complex two-stage bending operation while achieving equivalent or superior terminal configuration.
Data Source
AI summary
A multilayer solid aluminum electrolytic capacitor includes a casing, a multilayer core, an anode lead frame and a cathode lead frame. The multilayer core is formed by stacking and fixing a plurality of electrode sheets. The multilayer core is encapsulated in the casing. A junction between the anode region and the cathode region is provided with an isolation adhesive. The anode lead frame and the cathode lead frame are embedded at a bottom of the casing. Upper end surfaces of the anode lead frame and the cathode lead frame are respectively electrically connected to an anode end and a cathode end of the multilayer core. Lower end surfaces of the anode lead frame and the cathode lead frame are pass through a bottom surface of the casing to lead out as an anode and a cathode, respectively.