Multilayer Capacitor Cover Composition for Heat Dissipation
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Solution Overview
Problem
High-temperature and high-pressure environments in electric vehicle circuits lead to heat dissipation issues in multilayer ceramic capacitors, accelerating dielectric layer deterioration and reducing the component's lifespan.
Innovation Solution
A multilayer electronic component design that includes a cover portion with a perovskite structured dielectric material and a metal such as Cu, W, Ag, or Zn, where the metal content is between 2.0 and 9.0 moles based on 100 moles of element B, to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a multilayer ceramic capacitor operates in high-temperature and high-voltage environments, then it can serve electric vehicle circuits such as OBC and DC/DC converters, but heat dissipation issues occur due to dielectric loss and metal resistance, accelerating dielectric layer deterioration and reducing lifespan
Solution Approach 1:
The patent changes the chemical composition parameters of the dielectric layer by incorporating specific metal elements (Ni, Cu, Zn, Mn, Co, Fe) with controlled mole ratios relative to element B. This compositional parameter adjustment optimizes both the high-temperature stability and heat dissipation properties, allowing the capacitor to maintain reliability in harsh environments while extending lifespan
Solution Approach 2:
The patent creates a composite dielectric material system by combining element B (Ti, Zr, or Hf) with multiple metal elements (Ni, Cu, Zn, Mn, Co, Fe) in specific proportions. This composite structure leverages the synergistic effects of different metals to simultaneously improve thermal stability and electrical properties, resolving the contradiction between environmental adaptability and component lifespan
2Temperature
If the metal content in the cover portion is increased to improve heat dissipation, then thermal conductivity improves, but the dielectric properties may deteriorate
Solution Approach 1:
The patent precisely controls the metal content parameter within the range of 2.0-9.0 moles per 100 moles of element B in the cover portion. This parameter optimization ensures sufficient thermal conductivity for heat dissipation while maintaining the dielectric properties necessary for stable electrical performance
Solution Approach 2:
The patent applies different material compositions to different parts of the component: the cover portion contains metals (Cu, W, Ag, Zn) with 2.0-9.0 moles per 100 moles of element B for enhanced heat dissipation, while the dielectric layer uses a different composition with 0.1-2.0 moles of metals per 100 moles of element B for optimal electrical properties. This local differentiation resolves the contradiction between heat dissipation and dielectric stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed design effectively dissipates heat generated in the multilayer electronic component, improving its reliability and extending its lifespan even in harsh high-temperature and high-pressure conditions.
Implementation Method 1
the cover portion includes a first dielectric material having a perovskite structure represented by the formula ABO3, and a first metal including one or more of Cu, W, Ag, and Zn
Data Source
AI summary
A multilayer electronic component includes a body including a capacitance forming portion including a dielectric layer and an internal electrode, alternately arranged in a first direction, and a cover portion disposed on both surfaces of the capacitance forming portion opposing the first direction; and an external electrode disposed outside the body and connected to the internal electrode, wherein the cover portion includes a first dielectric material having a perovskite structure represented by the formula ABO3, and a first metal including one or more of Cu, W, Ag, and Zn, and wherein, in at least a portion of the cover portion, an amount of the first metal is 2.0 mole or more and 9.0 mole or less, based on 100 mole of an element of B.