Multilayer Capacitor Insulating Layer for Moisture Barrier
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Solution Overview
Problem
Multilayer ceramic capacitors face challenges in miniaturization and high capacitance requirements, with increased vulnerability to moisture and plating solution permeation due to reduced thickness, necessitating improved reliability and reduced mounting space.
Innovation Solution
A multilayer electronic component design featuring a dielectric layer and alternately disposed internal electrodes, with external electrodes and insulating layers including zirconium oxide to prevent moisture and plating solution permeation, while maintaining high capacitance and reduced size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the thickness of internal electrodes and dielectric layers is reduced to increase the number of laminated layers, then capacitance per unit volume is improved, but the component becomes more vulnerable to moisture and plating solution permeation
Solution Approach 1:
The patent applies composite materials by forming an insulating layer comprising a first oxide (including zirconium) and a second oxide (including aluminum) on the external electrodes. This composite oxide structure provides enhanced barrier properties against moisture and plating solution permeation while maintaining the miniaturized structure with reduced internal electrode and dielectric layer thicknesses, thus resolving the contradiction between high capacitance density and reliability.
Solution Approach 2:
The patent applies local quality by selectively forming the insulating layer comprising specific oxides (zirconium and aluminum) on the external electrodes and connection portions where moisture and plating solution permeation is most critical. This localized application of protective material with specific properties addresses the vulnerability at critical interfaces without requiring overall thickening of the component structure.
2Quantity of substance
If the number of laminated layers is increased to achieve high capacitance, then capacitance is improved, but the mounting space required increases
Solution Approach 1:
The patent applies dimensionality change by increasing the number of laminated layers in the vertical direction (thickness direction) rather than expanding the component in planar dimensions. This allows achieving high capacitance through increased layer count while maintaining a compact footprint, effectively transitioning from two-dimensional expansion to three-dimensional stacking to resolve the contradiction between capacitance and mounting space.
3Area of stationary object
If the thickness of margin is reduced for miniaturization, then mounting space is reduced, but permeation of external moisture and plating solution is facilitated
Solution Approach 1:
The patent applies local quality by selectively forming the insulating layer comprising zirconium oxide and aluminum oxide on the external electrodes and connection portions where moisture and plating solution permeation is most critical. This localized protective structure provides enhanced barrier properties at vulnerable interfaces without requiring overall increase in component dimensions, thus maintaining miniaturization while improving resistance to harmful permeation.
Solution Approach 2:
The patent applies composite materials by using a combination of zirconium oxide and aluminum oxide in the insulating layer formed on external electrodes and connection portions. This composite oxide structure provides superior barrier properties against moisture and plating solution permeation compared to single-oxide structures, enabling effective protection in miniaturized components with reduced margin thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances capacitance per unit volume, improves reliability by preventing moisture and plating solution ingress, and reduces mounting space, addressing the challenges of miniaturization and high capacitance while ensuring robustness.
Implementation Method 1
an insulating layer disposed on the first and second connection portions and covering the second surface and the third and fourth band portions, the insulating layer including a first oxide including zirconium (Zr)
Data Source
AI summary
A multilayer electronic component includes a body including first and second surfaces opposing each other in a first direction, and third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion disposed on the third surface, and a third band portion extending from the first connection portion to a portion of the second surface; a second external electrode including a second connection portion disposed on the fourth surface, and a fourth band portion extending from the second connection portion to a portion of the second surface; an insulating layer disposed on the first and second connection portions and covering the second surface and the third and fourth band portions; the insulating layer includes an oxide including zirconium (Zr).