Multilayer Capacitor Insulating Layer Warpage Strength

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Multilayer capacitors face challenges in mechanical stress resistance and warpage strength, particularly in strong mechanical stress environments, due to their low ductility and vulnerability to physical stress, which affects their reliability and performance.

Innovation Solution

A multilayer capacitor design featuring a capacitor body with sintered layers and plating layers connected to internal electrodes, an insulating layer covering the band portions of the sintered layers, and conductive resin layers to enhance mechanical properties and reduce stress transmission, while maintaining electrical connectivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multilayer capacitor is used in strong mechanical stress environment, then electrical connectivity is maintained, but warpage strength is insufficient and reliability deteriorates

Engineering Contradiction:
ImprovereliabilityVSAvoidwarpage strength
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent applies composite materials by combining the sintered layer (providing electrical conductivity) with the insulating layer (providing mechanical strength and warpage resistance). This composite structure allows the external electrode to maintain both electrical connectivity and enhanced mechanical strength, resolving the contradiction between reliability and warpage strength.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The external electrode is segmented into two distinct functional layers: the sintered layer for electrical connection and the insulating layer for mechanical support. This segmentation allows each layer to optimize its specific function, with the insulating layer providing the necessary warpage strength without compromising the electrical properties of the sintered layer.

Inventive Principle:
Principle #1Segmentation

2Strength

If insulating layer is added to cover sintered layer band portions, then warpage strength is improved, but device complexity increases

Engineering Contradiction:
Improvewarpage strengthVSAvoiddevice complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The insulating layer serves multiple functions simultaneously: it provides mechanical strength to improve warpage resistance, protects the sintered layer, and maintains electrical insulation. This multi-functionality justifies the added structural element by delivering multiple benefits from a single component, thereby managing device complexity effectively.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If sintered layers and plating layers are used for electrical connection, then electrical connectivity is achieved, but mechanical stress resistance is insufficient

Engineering Contradiction:
Improveelectrical connectivityVSAvoidmechanical stress resistance
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The combination of sintered layer and insulating layer creates a composite external electrode structure where the sintered layer ensures electrical connectivity while the insulating layer provides mechanical stress resistance. This composite approach resolves the contradiction by allowing both electrical and mechanical requirements to be met simultaneously.

Inventive Principle:
Principle #40Composite materials

Data Source

PatentUS11469051B2Multilayer capacitor and board having the same mounted thereon
Publication Date: 2022.10.11 SAMSUNG ELECTRO MECHANICS CO LTD
  • US11469051B2 patent drawing
  • US11469051B2 patent drawing
  • US11469051B2 patent drawing

AI summary

A multilayer capacitor includes a capacitor body including first to six surfaces, and including a dielectric layer, first and second internal electrodes, and first and second external electrodes. The first and second external electrodes include first and second sintered layers, and first and second plating layers, respectively. An insulating layer is disposed on the capacitor body, to cover an end portion of a first band portion of the first sintered layer and an end portion of a second band portion of the second sintered layer, and has a maximum thickness of 10 μm or more. A portion of the first band portion of the first sintered layer is exposed from the insulating layer. A portion of the second band portion of the second sintered layer is exposed from the insulating layer.