Multilayer Capacitor Lead-In Structure for Moisture Resistance
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Solution Overview
Problem
The interface between the capacitance formation portion and the cover portion in multilayer ceramic capacitors is prone to moisture penetration, compromising moisture resistance reliability.
Innovation Solution
Incorporating a lead-in portion made of glass between the capacitance formation portion and the cover portion, which blocks the external moisture penetration path and enhances the interfacial bonding strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If cover portions are disposed on the upper and lower parts of the capacitance formation portion to protect the internal electrodes, then the internal electrodes are protected, but moisture resistance reliability deteriorates due to easy moisture penetration at the interface
Solution Approach 1:
A lead-in portion extending from the internal electrode into the body serves as an intermediary structure that blocks moisture penetration paths at the interface between the capacitance formation portion and cover portion. The lead-in portion made of conductive paste with metal particles and binder creates a physical barrier that prevents moisture from reaching the internal electrode interface, thereby resolving the contradiction between electrode protection and moisture resistance.
2Ease of manufacture
If the interface between capacitance formation portion and cover portion is simplified for ease of manufacture, then manufacturing is easier, but interfacial bonding strength deteriorates
Solution Approach 1:
The lead-in portion is formed by extending conductive paste from the internal electrode into the body during the printing process, before the coating and firing stages. This preliminary formation of the lead-in structure ensures strong interfacial bonding is established in advance, allowing the interface to remain simple for manufacturing while maintaining high bonding strength through the extended conductive paste structure.
Data Source
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AI summary
A multilayer electronic component includes a body including a capacitance formation portion including a dielectric layer and an internal electrode alternately stacked with the dielectric layer, and a cover portion disposed on both end surfaces of the capacitance formation portion in a stacking direction of the dielectric layer and the internal electrode, and an external electrode disposed on the body. When an area introduced inwardly from a surface of the body and including glass is defined as a lead-in portion, the lead-in portion is disposed between the capacitance formation portion and the cover portion.