Multilayer Capacitor Electrode Structure for Low ESR and Crack Resistance
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Solution Overview
Problem
Existing multilayer ceramic capacitors face issues with non-uniform external electrode thickness, leading to reduced capacitance per unit volume and reliability due to moisture and plating solution penetration, as well as increased Equivalent Series Resistance (ESR) from conductive resin layers.
Innovation Solution
The multilayer electronic component features a body with internal electrodes and dielectric layers, and external electrodes comprising base electrode layers, intermediate electrode layers, conductive resin layers, and plating layers. The intermediate electrode layers are strategically placed on corners to prevent moisture and plating solution penetration, while the conductive resin layers help in crack prevention during mounting without increasing ESR.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the external electrode is formed by the dipping method, then the external electrode can be formed on the body, but the thickness of the external electrode is not uniform and capacitance per unit volume cannot be secured
Solution Approach 1:
The external electrode is designed with different thicknesses in different regions: thicker at the corner portions and thinner at the central portion. This local variation in thickness ensures uniform capacitance distribution throughout the body while maintaining adequate coverage at critical corner areas, thereby achieving both manufacturing precision and optimal capacitance per unit volume.
2Manufacturing precision
If the external electrode is formed by the dipping method, then the external electrode can be formed on the body, but plating solution and moisture penetrate into the body through the corner portion
Solution Approach 1:
The external electrode is designed with increased thickness specifically at the corner portions where moisture and plating solution penetration is most likely to occur. This localized thickening creates a stronger barrier at these critical areas, preventing penetration while maintaining adequate coverage for reliable electrical connection.
3Strength
If the conductive resin layer is formed to be thick to prevent cracks, then cracks due to mounting can be prevented, but capacitance per unit volume cannot be secured
Solution Approach 1:
The conductive resin layer is applied selectively and with controlled thickness, primarily at the corner portions of the external electrode where crack initiation is most likely. This localized application provides crack prevention where needed while minimizing the overall volume occupied by the resin layer, thereby preserving capacitance per unit volume in the central capacitance-forming regions.
4Strength
If the conductive resin layer is formed to be thick to prevent cracks, then cracks due to mounting can be prevented, but ESR increases
Solution Approach 1:
The conductive resin layer is applied selectively at the corner portions of the external electrode where mechanical stress and crack initiation are most likely to occur. This localized thin application provides sufficient crack resistance while minimizing the total volume of high-resistance material, thereby keeping the Equivalent Series Resistance (ESR) low and maintaining good electrical performance.
Data Source
AI summary
A multilayer electronic component, in which an external electrode may include a base electrode layer disposed on a surface of a body of the multilayer electronic component and connected to internal electrodes of the body, an intermediate electrode layer disposed on a corner of the body and connected to the base electrode layer, a conductive resin layer disposed on the intermediate electrode layer, and a plating layer disposed on the conductive resin layer. The intermediate electrode layer may be in contact with the plating layer on the corner of the body to prevent an increase in ESR while preventing cracks due to mounting through the conductive resin layer.