Multilayer Capacitor Electrode Layout for Low ESR and Moisture Resistance
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Solution Overview
Problem
Existing multilayer ceramic capacitors face challenges in maintaining low equivalent series resistance (ESR) while minimizing external electrode exposure and ensuring electrical connectivity between internal and external electrodes.
Innovation Solution
A multilayer electronic component design featuring extension portions with spaced-apart lead electrodes connected by via electrodes and covered by insulating portions, which enhance connectivity and minimize external electrode exposure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate lead electrode is formed on the cross-section of the body to minimize external electrode exposure, then moisture resistance reliability is improved, but electrical connectivity between internal electrode and lead electrode is insufficient causing increased ESR
Solution Approach 1:
The lead electrode is segmented into multiple spaced-apart electrodes rather than a single continuous electrode. This segmentation allows the insulating portion to be positioned between them, providing moisture barrier functionality while maintaining electrical connectivity through the via electrodes that connect to multiple internal electrodes.
Solution Approach 2:
The via electrodes serve as intermediaries that connect the spaced-apart lead electrodes to the internal electrodes. These via electrodes bridge the gap created by the segmented lead electrode structure, ensuring sufficient electrical connectivity and low ESR while allowing the insulating portion to perform its moisture barrier function.
2Area of stationary object
If lead electrodes are spaced apart with insulating portion covering them, then external electrode exposure is minimized, but electrical connectivity path is lengthened increasing ESR
Solution Approach 1:
The electrical connectivity is achieved not only through the horizontal spacing of lead electrodes but also through the vertical dimension via via electrodes that connect to internal electrodes. This dimensional transition allows compact spacing while maintaining effective electrical pathways, minimizing external exposure area without significantly lengthening the electrical path.
3Loss of energy
If multiple via electrodes are used to connect spaced lead electrodes, then electrical connectivity is improved, but device complexity increases
Solution Approach 1:
The via electrodes serve multiple functions: they provide electrical connectivity between lead electrodes and internal electrodes, act as mechanical support structures, and work in conjunction with the insulating portion to define the electrical boundaries. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity.
Data Source
AI summary
A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately arranged in a first direction with the dielectric layer interposed therebetween, an extension portion disposed on the body, and an external electrode arranged on the extension portion, wherein the extension portion includes a plurality of lead electrodes spaced apart in a second direction, perpendicular to the first direction, a plurality of via electrodes connecting the plurality of lead electrodes, and an insulating portion covering the plurality of lead electrodes.