Multilayer Capacitor Margin Structure for Miniaturization and Reliability
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Solution Overview
Problem
Multilayer capacitors face challenges in achieving improved reliability, capacitance, and miniaturization while maintaining high withstand voltage and strength, particularly in electronic and electrical devices.
Innovation Solution
The design incorporates a multilayer structure with alternately stacked internal electrodes and dielectric layers, surrounded by side margin layers and edge margin portions, with central internal electrodes having a greater median width and recessed corners, and covered by upper and lower layers to enhance adhesion and prevent environmental penetration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of multilayer capacitors is reduced for miniaturization, then the capacitance and reliability deteriorate due to insufficient overlap area and weakened structural strength
Solution Approach 1:
The patent introduces side margin layers that extend beyond the edges of the multilayer structure in the stacking direction, dividing the protective function into multiple segments: corner portions protected by side margin layers, edge portions protected by side margin layers, and surface portions protected by cover layers. This segmentation allows comprehensive protection while maintaining compact size.
Solution Approach 2:
The patent extends protection from the traditional two-dimensional surface coverage to three-dimensional coverage by having side margin layers protrude from the side surfaces in the stacking direction. This adds a vertical dimension to the protection structure, enabling corner and edge protection without increasing the horizontal footprint.
2Volume of moving object
If the size of multilayer capacitors is reduced for miniaturization, then the capacitance deteriorates due to reduced electrode overlap area
Solution Approach 1:
The side margin layers extend in the stacking direction (vertical dimension) rather than only in the horizontal plane, allowing the capacitor to maintain effective electrode overlap area while reducing the horizontal footprint. This dimensional change enables miniaturization without sacrificing capacitance.
3Ease of manufacture
If conventional structures without side margin layers are used, then the manufacturing process is simpler, but the reliability deteriorates due to delamination and environmental exposure
Solution Approach 1:
The side margin layers are formed as integral parts of the multilayer structure during the stacking process, before final sintering. This preliminary formation of protective margins ensures that corners and edges are protected from the outset, preventing delamination and environmental penetration without requiring complex post-processing steps.
4Device complexity
If corner portions are not protected, then the structure is simpler, but the reliability deteriorates due to environmental penetration and delamination at corners
Solution Approach 1:
The protection structure is segmented into different functional zones: side margin layers for corner and edge protection, and cover layers for surface protection. This segmentation allows each component to be optimized for its specific protective function while maintaining overall structural integrity.
Solution Approach 2:
The side margin layers are strategically positioned at corners and edges where environmental penetration and delamination are most likely to occur. This localized protection approach addresses the specific vulnerability of corner portions without unnecessarily complicating the entire structure.
Data Source
AI summary
A multilayer capacitor includes: a body including a multilayer structure in which one or more first internal electrodes and one or more second internal electrodes are alternately stacked in a first direction with one or more dielectric layers interposed therebetween; and first and second external electrodes disposed on the body and spaced apart from each other to be connected to the first internal electrodes and the second internal electrodes, respectively. The body further includes: a plurality of side margin layers with the multilayer structure interposed therebetween in a second direction, perpendicular to the first direction; and one or more edge margin portions for providing a margin between an edge of at least one of the side margin layers in a third direction and the multilayer structure, and between an edge of at least one of the side margin layers in the first direction and the multilayer structure.