Multilayer Capacitor Metal Frame with Titanium Coating for High Density Mounting
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Solution Overview
Problem
Multilayer capacitors in vehicles face challenges with low mounting density in limited spaces and insufficient insulation distance between metal frames, leading to compromised insulating properties and reliability under heat and vibration.
Innovation Solution
The design incorporates a multilayer capacitor with metal frames having protruding portions and coating films made of titanium, which are bonded to external electrodes and extend towards the edges, allowing for increased mounting density and sufficient insulation distance, ensuring better insulating properties and reliability through improved laser welding processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal frame is used to space the multilayer capacitor from the board, then durability against vibrations and deformation is improved, but mounting density decreases in limited space
Solution Approach 1:
The patent transitions from a conventional planar mounting structure to a three-dimensional structure by extending the mounting portion vertically downward from the support layer. This dimensional change allows the capacitor to be mounted on the board while maintaining spacing through the extended mounting portion, thereby improving both durability and mounting density simultaneously
Solution Approach 2:
The metal frame is segmented into distinct functional portions: a support layer for mechanical support, a mounting portion extending downward for board attachment, and protruding portions for electrical connection. This segmentation allows each portion to be optimized independently, resolving the contradiction between spacing requirements and mounting density
2Area of stationary object
If metal frames are positioned close to increase mounting density, then space utilization improves, but insulation distance between frames becomes insufficient, lowering insulating properties
Solution Approach 1:
The patent applies different properties to different parts of the metal frame: the mounting portion is designed for mechanical attachment and electrical connection, while the protruding portions are specifically engineered with insulating properties to ensure adequate insulation distance. This local differentiation allows close spacing while maintaining insulating performance
Solution Approach 2:
The patent introduces an insulating layer as an intermediary between adjacent metal frames or between conductive portions. This intermediary element ensures sufficient insulation distance is maintained even when frames are positioned closely together, allowing high mounting density without compromising insulating properties
3Ease of manufacture
If conventional metal frame structures are used, then manufacturing is simplified, but laser welding requires high energy and time, reducing productivity
Solution Approach 1:
The patent modifies the material parameters of the metal frame by incorporating specific materials with optimized laser absorption characteristics. This parameter change enables more efficient laser welding, reducing both energy consumption and welding time while maintaining manufacturing simplicity
Solution Approach 2:
The patent employs composite material structures in the metal frame, combining materials that offer both ease of manufacturing and optimized laser welding properties. This composite approach reduces laser welding energy and time requirements without compromising manufacturing simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances mounting density in limited spaces, secures adequate insulation between adjacent components, and improves reliability by reducing the energy and time required for laser welding, while preventing separation issues during soldering.
Implementation Method 1
a first coating film covering an upper surface of the first protruding portion on an upper surface of the first mounting portion and including titanium (Ti)
Data Source
AI summary
An electronic component and a board having the same mounted thereon are provided. The electronic component includes: a body; an electrode disposed on an end of the body in a first direction; a metal frame including a support layer bonded to the external electrode, a mounting portion extending in the first direction in a lower end of the support layer and having a protruding portion on a lower surface, and a coating film formed to cover an upper surface of the protruding portion on an upper surface of the mounting portion and including titanium (Ti).


