Multilayer Capacitor Insulating Layer Against Moisture Permeation
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Solution Overview
Problem
Multilayer ceramic capacitors face challenges in miniaturization, high capacitance, and reliability due to permeation of external moisture and plating solutions, which degrade performance and require improved protection methods.
Innovation Solution
A multilayer electronic component design featuring a dielectric layer with internal electrodes, external electrodes, insulating layers, and plating layers, including aluminum oxide, to prevent moisture and plating solution permeation, ensuring improved reliability and reduced mounting space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the thickness of the multilayer ceramic capacitor is reduced to achieve miniaturization and high capacitance, then the capacitance per unit volume increases, but the reliability decreases due to increased permeation of external moisture and plating solutions
Solution Approach 1:
The patent applies composite materials by forming a glass layer comprising at least one glass material on the external electrode. The glass material has specific compositional characteristics (SiO2: 30-70 wt%, Al2O3: 5-20 wt%, B2O3: 5-20 wt%) that provide both protective functionality and compatibility with the capacitor structure. This composite glass coating acts as a barrier layer that prevents moisture and plating solution permeation while maintaining the miniaturized structure's high capacitance density.
Solution Approach 2:
The patent implements a thin film protective layer approach by forming a glass coating on the external electrode surface. This thin glass film serves as a protective shell that shields the internal structure from environmental factors (moisture and plating solutions) without significantly increasing the overall size. The glass layer's thin nature allows the capacitor to maintain its compact form factor while achieving improved reliability against permeation.
2Quantity of substance
If the number of laminated layers is increased to achieve high capacitance, then the capacitance increases, but the mounting space increases
Solution Approach 1:
The patent utilizes parameter changes by optimizing the glass material composition and controlling the glass layer thickness (1-10 μm). By adjusting these parameters, the protective coating provides sufficient moisture barrier functionality without adding excessive volume. Additionally, the glass material's thermal expansion coefficient is designed to match the internal electrode material, preventing delamination and maintaining structural integrity in miniaturized multi-layer configurations.
Solution Approach 2:
The patent addresses the mounting space issue by transitioning from a two-dimensional area constraint to a three-dimensional volume optimization. Instead of increasing the planar footprint to accommodate more layers, the design stacks multiple capacitor layers vertically (increasing the thickness dimension). The glass protective layer on external electrodes enables this vertical stacking by providing reliable moisture protection at the interfaces, allowing high capacitance to be achieved within a compact footprint suitable for modern electronics.
3Length of moving object
If the thickness of the margin is reduced to achieve miniaturization, then the component size decreases, but the reliability decreases due to easier permeation of external moisture and plating solutions
Solution Approach 1:
The patent implements a thin film protective layer approach by forming a glass coating on the external electrode surface. This thin glass film serves as a protective shell that shields the internal structure from environmental factors (moisture and plating solutions) without significantly increasing the overall size. The glass layer's thin nature allows the capacitor to maintain its compact form factor while achieving improved reliability against permeation.
Solution Approach 2:
The patent applies composite materials by forming a glass layer comprising at least one glass material on the external electrode. The glass material has specific compositional characteristics (SiO2: 30-70 wt%, Al2O3: 5-20 wt%, B2O3: 5-20 wt%) that provide both protective functionality and compatibility with the capacitor structure. This composite glass coating acts as a barrier layer that prevents moisture and plating solution permeation while maintaining the miniaturized structure's high capacitance density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances capacitance per unit volume, improves reliability by preventing moisture and plating solution ingress, and reduces mounting space, addressing the challenges of miniaturization and high capacitance.
Implementation Method 1
the insulating layer covers the connection and band portions to prevent moisture and plating solution permeation
Implementation Method 2
the plating layers are strategically positioned to enhance reliability and reduce mounting space
Data Source
AI summary
A multilayer electronic component includes a body including first and second surfaces opposing each other in a first direction, and third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion disposed on the third surface and a first band portion extending from the first connection portion to a first portion of the first surface; a second external electrode including a second connection portion disposed on the fourth surface and a second band portion extending from the second connection portion to a first portion of the first surface; an insulating layer disposed on the second surface and extending to the first and second connection portions, the insulating layer including a first glass and a first oxide including aluminum (Al).