Multilayer Capacitor Mounting Structure for Acoustic Noise Reduction
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Solution Overview
Problem
Multilayer capacitors generate acoustic noise in audible frequency regions and high-frequency vibrations, which can be perceived as device malfunctions and degrade voice circuit quality, and interfere with sensors in IT and industrial applications.
Innovation Solution
A multilayer electronic component design featuring a multilayer capacitor with specific electrode and land portion configurations, including a connection terminal with a non-conductive bridge portion, is mounted on a substrate with electrode pads, optimizing the thickness ratio of the capacitor to the connection terminal to reduce acoustic noise by absorbing vibrations through insulator land portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a multilayer capacitor is used with piezoelectric dielectric material, then the capacitor can function as an electronic component, but acoustic noise is generated in the audible frequency region
Solution Approach 1:
A connection terminal comprising land portions and a bridge portion is introduced as an intermediary between the capacitor body and the substrate. This intermediary structure absorbs vibrations and prevents direct transmission of acoustic noise to the substrate, while maintaining the electrical connection function of the capacitor.
Solution Approach 2:
The harmful vibration transmission path is extracted and isolated from the main capacitor structure by separating the connection function into a distinct connection terminal with land portions and bridge portion, allowing the capacitor body to maintain its piezoelectric function while the connection terminal handles vibration absorption.
2Device complexity
If the capacitor body is directly mounted on the substrate, then the structure is simple, but vibrations are transmitted to the substrate causing acoustic noise
Solution Approach 1:
The connection terminal serves as a mediator between the capacitor body and substrate, with its specific structure (land portions with cutouts and bridge portion) designed to absorb vibrations while maintaining electrical connection, thus reducing vibration transmission without requiring complex additional mounting structures.
Solution Approach 2:
The dimensions of the connection terminal are specifically optimized with the thickness ratio T1/T2 between 0.6 and 0.9, where T1 is the capacitor body thickness and T2 is the distance from the uppermost end of external electrodes to the bottom of the connection terminal. This parameter optimization ensures effective vibration absorption while maintaining a relatively simple structure.
3Speed
If high frequency vibrations occur at 20 kHz or more, then the capacitor operates in high frequency region, but sensor malfunctioning occurs
Solution Approach 1:
The connection terminal acts as a vibration isolation intermediary that absorbs high frequency vibrations before they can interfere with sensors, allowing the capacitor to operate at high frequencies (20 kHz or more) without causing sensor malfunctionning.
Solution Approach 2:
The vibration absorption capability of the connection terminal converts the harmful high frequency vibrations into a beneficial effect by dissipating them through the land portions and bridge portion, preventing sensor interference while maintaining high frequency operation capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces acoustic noise in audible frequencies and high-frequency vibrations, preventing sensor malfunctions and improving device performance by minimizing vibration transmission to the substrate.
Implementation Method 1
the dielectric material is piezoelectric, and may thus be modified in synchronization with an applied voltage
Implementation Method 2
absorbing vibrations through insulator land portions
Data Source
AI summary
A multilayer electronic component includes a multilayer capacitor including a capacitor body and a plurality of external electrodes spaced apart from each other on a mounting surface of the capacitor body, and a connection terminal including a plurality of land portions disposed on the plurality of external electrodes, respectively. When a thickness of the multilayer capacitor is defined as T1 and a distance from an uppermost end of the plurality of external electrodes to a bottom of the connection terminal is defined as T2, T1/T2 is 0.6 to 0.9.