Multilayer Capacitor Oxide Insulating Layer for Moisture Resistance
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Solution Overview
Problem
Existing multilayer ceramic capacitors face challenges in maintaining moisture resistance reliability while avoiding increases in size and decreases in capacitance due to the formation of thick cover layers.
Innovation Solution
A multilayer capacitor design incorporating a thin, compact insulating layer formed from the oxidation of a metal layer, which is integrated with a conductive electrode layer to enhance moisture resistance without significantly increasing the capacitor's size, using materials like Ti, Al, V, Y, Zr, Nb, Hf, or Ta, and employing atomic layer deposition (ALD) for precise layer formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thick cover layer is formed to improve moisture resistance reliability, then moisture resistance reliability is improved, but the size of the multilayer capacitor increases and capacitance decreases
Solution Approach 1:
The patent applies this principle by forming a thin insulating layer (5 nm to 1 μm thickness) on the external electrode instead of using a thick cover layer. This thin film provides sufficient moisture protection while maintaining the compact size of the capacitor, directly resolving the contradiction between moisture resistance and size.
Solution Approach 2:
The patent changes the thickness parameter of the insulating layer to an optimized range (5 nm to 1 μm) that provides adequate moisture resistance without causing size increase. This parameter optimization allows the capacitor to maintain both reliability and compact dimensions.
2Reliability
If a thick cover layer is formed to improve moisture resistance reliability, then moisture resistance reliability is improved, but capacitance decreases at the same size
Solution Approach 1:
By using a thin insulating layer instead of a thick cover layer, the patent minimizes the space occupied by non-capacitive materials, thereby preserving the capacitance value while still providing adequate moisture protection.
Solution Approach 2:
The patent optimizes the insulating layer thickness parameter to balance moisture resistance and capacitance maintenance, ensuring that the protective layer is thin enough to minimize capacitance reduction while still providing reliable moisture barrier functionality.
3Volume of moving object
If the insulating layer thickness is reduced to minimize size increase, then size is maintained, but moisture resistance may be compromised
Solution Approach 1:
The patent identifies and applies an optimal thickness range (5 nm to 1 μm) for the insulating layer that provides the minimum thickness required for effective moisture barrier functionality while keeping the capacitor size compact. This parameter optimization resolves the contradiction between size and moisture resistance.
Solution Approach 2:
The patent replaces the traditional mechanical thick cover layer structure with a thin insulating layer formed through oxidation of a metal layer, achieving equivalent or superior moisture protection with minimal thickness through chemical process control.
4Volume of moving object
If a thin insulating layer is formed to maintain compact size, then size is maintained, but manufacturing precision requirements increase
Solution Approach 1:
The patent replaces mechanical thickness control methods with a chemical oxidation process that naturally forms insulating layers of controlled thickness through process parameters (oxidation time, temperature, atmosphere), thereby achieving precise thickness control without complex mechanical positioning.
Solution Approach 2:
The patent controls the oxidation process parameters (time, temperature, atmosphere composition) to precisely control the insulating layer thickness within the 5 nm to 1 μm range, making the manufacturing process more controllable despite the thin dimensions required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves moisture resistance reliability while minimizing the increase in capacitor size, maintaining capacitance, and enhancing mounting stability on circuit boards.
Implementation Method 1
the insulating layer includes an oxide of a metal component of the metal layer
Data Source
AI summary
A multilayer capacitor includes a body including a stack structure in which a plurality of dielectric layers are stacked and a plurality of internal electrodes stacked with respective dielectric layers interposed therebetween, external electrodes disposed on external surfaces of the body and connected to the internal electrodes, and an insulating layer covering a surface of the body. One of the external electrodes includes a metal layer connected to the insulating layer, and the insulating layer includes an oxide of a metal component of the metal layer.