Multilayer Capacitor Segmentation for High Capacitance Uniformity
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Solution Overview
Problem
Manufacturing large-sized multilayer capacitors with high capacitance is challenging due to uniformity issues and difficulties in removing binders, leading to increased defect rates and capacitance dispersion.
Innovation Solution
A multilayer electronic component is formed by connecting multiple small multilayer capacitors in a laminate configuration, with varying dielectric constants and internal electrode configurations to achieve high capacitance, while maintaining a compact size, and using terminals to cover external electrodes for improved bonding and mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a large-sized multilayer capacitor is manufactured to achieve high capacitance, then capacitance increases, but uniformity of sheet and internal electrodes deteriorates and binder removal becomes difficult
Solution Approach 1:
The invention divides a large-sized high-capacitance multilayer capacitor into multiple smaller multilayer capacitors with smaller individual capacitances. Each small capacitor maintains good uniformity and manufacturing quality, while the parallel connection of multiple small capacitors achieves the desired total capacitance. This segmentation approach resolves the contradiction by avoiding the manufacturing defects associated with large-sized single capacitors.
2Quantity of substance
If a large-sized multilayer capacitor is manufactured to achieve high capacitance, then capacitance increases, but defect rate increases and capacitance dispersion widens
Solution Approach 1:
By segmenting the large capacitor into multiple small capacitors, each small unit can be manufactured with lower defect rates. The parallel connection of multiple reliable small capacitors achieves high total capacitance while maintaining overall reliability. This approach avoids the increased defect rates and capacitance dispersion associated with manufacturing large-sized single capacitors.
3Quantity of substance
If multiple small multilayer capacitors are connected in parallel to achieve high capacitance, then capacitance increases and manufacturing quality improves, but device complexity increases
Solution Approach 1:
The invention merges multiple small multilayer capacitors into a single integrated laminate structure through co-firing. The capacitors are arranged in parallel and connected via shared external electrodes, creating a unified component that functions as a single high-capacitance device. This merging approach reduces the complexity of assembling and connecting separate capacitors while maintaining the benefits of multiple small units.
4Volume of moving object
If the thickness of ceramic sheet is reduced to achieve compact size, then size decreases, but uniformity deteriorates and binder removal becomes difficult
Solution Approach 1:
Instead of reducing the thickness of a single large ceramic sheet, the invention uses multiple small capacitors with adequate individual thicknesses that maintain manufacturing uniformity. These small capacitors are stacked and connected in parallel to achieve compact overall dimensions. This segmentation allows compact size achievement without compromising the uniformity and binder removal characteristics of thin ceramic sheets.
Data Source
AI summary
A multilayer electronic component includes: a laminate having a plurality of multilayer capacitors are disposed to be adjacent to each other, each of the multilayer capacitors including a body including dielectric layers and first and second internal electrodes alternately exposed through two end surfaces of the body facing each other in a length direction with each of the dielectric layers interposed therebetween, and first and second external electrodes disposed on the two end surfaces of the body in the length direction, respectively; and first and second terminals disposed on the laminate to cover a plurality of first and second external electrodes, respectively.