Multilayer Capacitor Layout for Vertically Spaced Conductors
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Solution Overview
Problem
Existing capacitor devices face challenges in being mounted between two conductors spaced apart in the lamination direction of a multilayer body, particularly in semiconductor devices, due to their design and electrical connection limitations.
Innovation Solution
The capacitor device features a multilayer body with dielectric and conductor layers alternately laminated, and external electrodes formed on opposite sides, allowing it to be mounted between two conductors spaced apart, with conductive members connecting the electrodes to the capacitor element, enhancing reliability and performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a chip-type multilayer capacitor is mounted to two conductors spaced apart in the orthogonal direction, then the capacitor can be integrated into semiconductor modules, but the mounting reliability and electrical connection stability deteriorate due to the spaced-apart configuration
Solution Approach 1:
The patent transitions from orthogonal mounting (side-by-side conductors) to lamination-direction mounting (stacked conductors). The multilayer capacitor's external electrodes are positioned on the top and bottom surfaces of the multilayer body, allowing connection to conductors arranged vertically rather than horizontally. This dimensional change enables more reliable electrical connections while maintaining integrability into semiconductor modules.
Solution Approach 2:
The patent introduces conductive members as intermediary elements that facilitate the electrical connection between the external electrodes and the conductors. These conductive members bridge the gap between the capacitor terminals and the circuit board conductors, providing stable mechanical and electrical connection even when conductors are spaced apart, thus resolving the reliability issue.
2Device complexity
If external electrodes are formed on opposite ends of the multilayer body in the orthogonal direction, then the capacitor structure is simplified, but the internal inductance increases and heat dissipation performance deteriorates
Solution Approach 1:
The patent repositions the external electrodes from orthogonal-facing sides to top and bottom surfaces of the multilayer body. This spatial reconfiguration changes the current path geometry, reducing the loop area and thus minimizing internal inductance. The lamination-direction arrangement also improves heat dissipation by providing direct thermal pathways through the conductive members to the circuit board, while maintaining relatively simple electrode formation processes.
Data Source
AI summary
A capacitor device includes a capacitor element, an insulating cover covering the capacitor element, a first external electrode exposed from the insulating cover, a second external electrode exposed from the insulating cover, a first conductive member electrically conducting to the first external electrode and the capacitor element, and a second conductive member electrically conducting to the second external electrode and the capacitor element. The capacitor element includes a multilayer body comprising a plurality of dielectric layers and a plurality of conductor layers alternately laminated in a first direction. The insulating cover covers the entirety of the capacitor element except a connection portion where the capacitor element and the first conductive member are connected and a connection portion where the capacitor element and the second conductive member are connected. The first external electrode and the second external electrode are formed on opposite sides of each other in the first direction.