Multilayer Capacitor Electrode Stacking for Capacitance Density

The patent transitions from conventional planar electrode arrangement to a three-dimensional stacked configuration where internal electrodes are arranged in multiple layers along the thickness direction. This dimensional change allows increasing the number of capacitor elements within the same footprint area, thereby increasing capacitance per unit volume without reducing dielectric layer thickness. The internal electrodes are alternately connected to first and second external electrodes, creating multiple series/parallel combinations that achieve high capacitance while maintaining adequate dielectric thickness for reliability.

The patent divides the capacitor structure into multiple segmented dielectric layers and internal electrode layers stacked in sequence. Each segment maintains adequate thickness to withstand voltage stress, while the series connection of multiple segments distributes the voltage stress across each layer. This segmentation allows achieving high capacitance through increased layer count rather than increasing individual layer capacitance, thereby maintaining voltage withstand characteristics.

The patent optimizes the geometric parameters of internal electrodes, including their width, length, and spacing, to achieve high capacitance density while maintaining manufacturability. By carefully controlling the overlap area between adjacent internal electrodes and adjusting the spacing parameters, the design achieves high capacitance per unit volume without requiring extreme manufacturing precision. The parameter optimization balances electrical performance with fabrication capabilities.