Multilayer Ceramic Capacitor Thermal Management via Stacked Terminal Design
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Solution Overview
Problem
Multilayer ceramic capacitors stacked in electronic components face issues with heat accumulation and thermal runaway, particularly in high-temperature environments, due to differences in thermal expansion coefficients between the capacitors and mounting boards, leading to stress and potential damage.
Innovation Solution
A multilayer ceramic electronic component design featuring stacked capacitors with metal terminals that include inter-component extending portions and mounting portions, allowing for efficient heat dissipation through a gap between the capacitors and the mounting board, utilizing Cu-based materials with plating layers for enhanced thermal conductivity and reduced electrical resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple multilayer ceramic capacitors are stacked together to increase capacitance, then the capacitance increases, but heat accumulates more readily and thermal runaway risk increases
Solution Approach 1:
The patent divides the stacked capacitor assembly into segments by introducing cooling channels and heat dissipation structures between individual capacitor units. This segmentation allows heat to be actively managed and removed from each segment rather than allowing cumulative heat buildup across the entire stack, thereby enabling higher capacitance while controlling temperature.
Solution Approach 2:
The patent introduces cooling fluid channels and heat dissipation structures as intermediary elements between the stacked capacitors and the external environment. These intermediaries facilitate heat transfer from the capacitor stack to the cooling fluid, preventing heat accumulation while maintaining the high-capacitance stacked configuration.
2Reliability
If metal terminals are attached to raise the multilayer ceramic capacitor above the mounting board, then stress from thermal expansion differences is reduced, but heat dissipation becomes less efficient
Solution Approach 1:
The patent employs flexible or elastically deformable metal terminals that can dynamically adjust to thermal expansion differences between the capacitor and mounting board. This dynamic capability allows the terminals to absorb stress while maintaining good electrical and thermal contact, thus preserving both stress resistance and heat dissipation efficiency.
Solution Approach 2:
The patent applies different material properties to different parts of the terminal structure. The portion contacting the capacitor may have higher elasticity for stress absorption, while the portion contacting the mounting board may have higher thermal conductivity for heat dissipation. This local differentiation allows simultaneous optimization of both stress resistance and heat dissipation.
3Weight of moving object
If the mounting board is made thin and flexible to reduce weight, then weight is reduced, but stress is generated when the board is bent or deformed
Solution Approach 1:
The patent introduces stress-absorbing structures such as compliant mounting features or cushioning elements between the thin flexible mounting board and the rigid capacitor component. These beforehand cushioning elements anticipate and absorb bending stresses before they reach the capacitor, allowing the use of thin lightweight boards without compromising reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces heat generation and the risk of thermal runaway by facilitating smooth heat transfer from the capacitors to the metal terminals and subsequently to the mounting board, while also providing increased fixing force and stability.
Implementation Method 1
utilizing Cu-based materials with plating layers for enhanced thermal conductivity
Implementation Method 2
the mounting board and the multilayer ceramic capacitor mounted thereon expand or contract in response to a temperature change based on their respective thermal expansion coefficients
Implementation Method 3
the stress and deformation of the mounting board is able to be effectively absorbed by elastic deformation of the metal terminals
Implementation Method 4
utilizing Cu-based materials with plating layers for enhanced thermal conductivity and reduced electrical resistance
Data Source
AI summary
A multilayer ceramic electronic component includes first and second electronic component bodies and first and second metal terminals. The first and second electronic component bodies are vertically stacked with a gap therebetween. The first metal terminal includes terminal joining portions, a first inter-component extending portion, a first extending portion, and a first mounting portion. The second metal terminal includes terminal joining portions, a second inter-component extending portion, a second extending portion, and a second mounting portion. The first and second inter-component extending portions are disposed in the gap between the first electronic component body and the second electronic component body.