Multilayer Capacitor Electrode Structure for Bending Stress Resistance

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Solution Overview

Problem

Multilayer ceramic capacitors face challenges in maintaining reliability and durability due to their brittle nature, which can lead to stress-related issues and potential short circuits, especially in extreme environments.

Innovation Solution

The proposed solution involves a multilayer electronic component design with enhanced bending strength and impact resistance, featuring a body with dielectric layers and internal electrodes alternately stacked, and external electrodes comprising connection electrode layers made of conductive metal, band electrode layers made of conductive polymer, and a plating layer, where the conductive metal includes palladium (Pd), silver (Ag), rhodium (Rh), or ruthenium (Ru).

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If a multilayer ceramic capacitor is miniaturized to achieve high capacitance density, then the capacitance per unit volume increases, but the component becomes more susceptible to stress and impact damage

Engineering Contradiction:
Improvecapacitance densityVSAvoidstress resistance
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The patent applies composite materials by combining a conductive polymer (band electrode layer) with conductive metal (connection electrode layer and plating layer). The conductive polymer provides flexibility and stress absorption, while the conductive metal ensures electrical conductivity. This composite structure allows the capacitor to maintain high capacitance density while improving resistance to stress and impact damage.

Inventive Principle:
Principle #40Composite materials

2Volume of moving object

If the ceramic body is made thinner to reduce component size, then the overall dimensions decrease, but the bending strength and impact resistance deteriorate

Engineering Contradiction:
Improvecomponent sizeVSAvoidbending strength
Core Design Contradiction:
Volume of moving objectVSStrength

Solution Approach 1:

The patent introduces a flexible band electrode layer made of conductive polymer that wraps around the ceramic body. This flexible layer acts as a protective shell that can absorb impact energy and distribute stress, thereby improving bending strength and impact resistance without increasing the overall component size.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The conductive polymer band electrode layer serves as a pre-applied cushioning layer that absorbs impact energy before it reaches the brittle ceramic body. This beforehand cushioning protects the thin ceramic structure from stress-related failures during mounting and operation.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

3Ease of manufacture

If conventional external electrode structures are used, then the manufacturing process is simple, but the component lacks sufficient protection against external shocks and stress

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidexternal shock resistance
Core Design Contradiction:
Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The conductive polymer band electrode layer acts as an intermediary between the ceramic body and the external environment. It provides mechanical protection against shocks and stress while maintaining electrical connectivity through the conductive metal layers, thus protecting the component without significantly complicating the manufacturing process.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS20250166923A1Multilayer electronic component
Publication Date: 2025.05.22 SAMSUNG ELECTRO MECHANICS CO LTD
  • US20250166923A1 patent drawing
  • US20250166923A1 patent drawing
  • US20250166923A1 patent drawing

AI summary

A multilayer electronic component includes: a body including a dielectric layer and internal electrodes; and an external electrode disposed on the body, wherein the external electrode may include a connection electrode layer disposed on the body and connected to the internal electrodes and including a conductive metal, a band electrode layer in contact with the connection electrode layer and disposed on the body and including a conductive polymer, and a plating layer disposed on the connection electrode layer and the band electrode layer, and the conductive metal may include at least one selected from the group consisting of palladium (Pd), silver (Ag), rhodium (Rh), and ruthenium (Ru).