Multilayer Capacitor Margin Layer Using Ta4AlC3 to Limit Sintering Steps

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Solution Overview

Problem

The existing multilayer ceramic capacitors face issues with step portions occurring during compression and sintering due to differences in thermal expansion coefficients between the capacitance forming portion and the margin portion, leading to potential bending of internal electrode ends and compromised adhesion with external electrodes.

Innovation Solution

Incorporating a second dielectric layer made of Ta4AlC3 in the margin portions of the multilayer electronic component, which helps to cancel out pressure and alleviate uneven expansion and contraction, thereby reducing step portion differences and internal electrode bending.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If compression and sintering are performed on the multilayer body, then the internal electrodes are connected to external electrodes, but step portions occur due to difference in thermal expansion coefficients between capacitance forming portion and margin portion

Engineering Contradiction:

Improveadhesion between internal electrodes and external electrodesVSAvoidstep portion formation

Core Design Contradiction:

ReliabilityVSShape

Solution Approach 1:

The patent applies different dielectric materials to different regions of the multilayer body. The capacitance forming portion uses a first dielectric material while the margin portion uses a second dielectric material with different thermal expansion characteristics. This local differentiation of material properties allows each region to expand and contract appropriately during sintering, preventing step portion formation while maintaining good adhesion between internal and external electrodes.

Inventive Principle:

Principle #3Local quality

2Reliability

If margin portion includes internal electrodes with different lamination degree, then capacitance is not formed in margin portion, but uneven pressure is applied during compression making adhesion difficult

Engineering Contradiction:

Improveadhesion between internal electrodes and external electrodesVSAvoiduneven pressure distribution

Core Design Contradiction:

ReliabilityVSStress or pressure

Solution Approach 1:

The patent introduces a second dielectric layer specifically in the margin portion that has different mechanical and thermal properties from the first dielectric layer in the capacitance forming portion. This local material differentiation compensates for the uneven pressure distribution during compression by providing appropriate compliance in the margin region, ensuring uniform adhesion quality across the entire multilayer structure.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent employs a composite dielectric structure where the margin portion consists of a combination of the first dielectric layer and a second dielectric layer with specific material properties. This composite construction in the margin region provides optimized mechanical support and thermal management, enabling better pressure distribution and adhesion during the compression and sintering processes.

Inventive Principle:

Principle #40Composite materials

3Reliability

If sintering process is performed, then internal electrodes are sintered, but step portion occurs due to difference in thermal expansion and contraction

Engineering Contradiction:

Improvesintering qualityVSAvoidstep portion formation

Core Design Contradiction:

ReliabilityVSShape

Solution Approach 1:

The patent implements a second dielectric layer in the margin portion with thermal expansion characteristics specifically designed to match or complement the margin region's requirements. During sintering, this local material differentiation ensures that the margin portion and capacitance forming portion expand and contract harmoniously, preventing step portion formation while maintaining high sintering quality and electrode adhesion.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The use of Ta4AlC3 in the second dielectric layer improves the reliability of the multilayer electronic component by enhancing adhesion between internal and external electrodes, reducing moisture resistance issues, and facilitating miniaturization while maintaining high capacitance.

Implementation Method 1

a step portion may occur due to a difference in thermal expansion and contraction due to a difference in thermal expansion coefficients between the capacitance forming portion and the margin portion

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 2

reducing moisture resistance issues

Methodology Applied

Scientific EffectMoisture resistance:

Data Source

PatentUS12224124B2Multilayer electronic component

Publication Date: 2025.02.11 SAMSUNG ELECTRO MECHANICS CO LTD

AI summary

A multilayer electronic component includes a body including a first dielectric layer and internal electrodes alternately disposed with the first dielectric layer interposed therebetween in a first direction; and external electrodes disposed on the body. The internal electrodes include body portions alternately disposed with the first dielectric layer in the first direction to form capacitance, and end portions extending from the body portions in the second direction. A region including the first dielectric layer and the body portions in the body is a capacitance forming portion. Regions disposed on one surface and the other surface of the capacitance forming portion in the second direction and including the end portions of the internal electrodes is first margin portions. The first margin portions are disposed between the end portions of the internal electrodes and include a second dielectric layer including Ta4AlC3.