Multilayer Capacitor Electrode Structure for Stable Terminal Contact
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Solution Overview
Problem
Multilayer ceramic capacitors face issues with poor contact between the body and external electrodes due to differences in shrinkage rates during the sintering process, leading to variations in capacitance.
Innovation Solution
The design includes a body with a capacitance formation portion having dielectric layers and internal electrodes alternately disposed, and a cover portion on both end surfaces. The internal electrodes and dielectric layers protrude more outwardly than the cover portion, and grooves are disposed at the ends of the dielectric layers to improve contact with external electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the internal electrodes and dielectric layers are made thinner to increase capacitance density, then the capacitance per unit volume increases, but the contact between the body and external electrodes deteriorates due to shrinkage rate differences during sintering
Solution Approach 1:
The patent applies preliminary action by forming protrusions on the internal electrodes and dielectric layers before the final sintering process. These protrusions are intentionally designed to extend beyond the cover portion, ensuring that contact with external electrodes is established in advance before any shrinkage occurs during sintering. This pre-positioning compensates for the shrinkage that will occur, maintaining reliable contact despite the thinning of components.
Solution Approach 2:
The patent utilizes parameter changes by modifying the physical geometry of the internal electrodes and dielectric layers, specifically creating protrusions that extend beyond the cover portion. This geometric parameter change ensures that even when the overall component shrinks during sintering, the protruding portions maintain contact with external electrodes. The protrusion height and position are carefully controlled to optimize both capacitance density and contact reliability.
2Reliability
If additional polishing processes are implemented to improve contact between body and external electrodes, then contact reliability improves, but manufacturing complexity and production time increase
Solution Approach 1:
The patent eliminates the need for post-sintering polishing by performing the contact-forming action in advance. The protrusions on internal electrodes and dielectric layers are formed during the green sheet stacking stage, before sintering. This preliminary formation of contact surfaces removes the requirement for subsequent polishing operations, reducing manufacturing complexity while ensuring reliable contact.
Solution Approach 2:
The structure design enables self-service by allowing the protrusions to automatically ensure contact during the sintering process itself. The geometric configuration of protruding internal electrodes and dielectric layers creates inherent contact points that do not require additional processing. The component essentially prepares its own contact surfaces through its structural design, eliminating the need for external polishing operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances contact between the body and external electrodes, reduces variations in capacitance, and allows for a thinner internal electrode thickness without the need for additional polishing processes, thereby improving the reliability of the multilayer electronic component.
Implementation Method 1
a difference in shrinkage rates between the dielectric layer and the inner electrodes may occur during the sintering process
Data Source
AI summary
A multilayer electronic component includes a body including a capacitance formation portion including dielectric layers and internal electrodes alternately disposed in a first direction, and a cover portion disposed on both end surfaces of the capacitance formation portion, facing each other in the first direction, and having a first surface and a second surface opposing each other in the first direction, a third surface and a fourth surface connected to the first and second surfaces and opposing each other in a second direction, and a fifth surface and a sixth surface connected to the first to fourth surfaces and opposing each other in a third direction, and external electrodes disposed on the third and fourth surfaces. The internal electrodes and the dielectric layers protrude more outwardly than the cover portion in the second direction, and a groove is disposed at an end of the dielectric layer in the second direction.