Multilayer Capacitor Through-Electrode Structure for Insulation Stability
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Solution Overview
Problem
The bending of internal electrode ends during the compression process in multilayer ceramic capacitors leads to electric field concentration and degradation of insulation resistance, potentially causing high-voltage shocks, and the formation of side margin portions reduces moisture resistance.
Innovation Solution
The introduction of through-electrodes that connect the ends of adjacent internal electrodes, preventing bending and electric field concentration, while maintaining moisture resistance by integrating the through-electrodes with the ceramic body during manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a side margin portion is formed by cutting a mother laminate and coating ceramic paste to cover the internal electrode pattern, then high-voltage shock is prevented and insulation resistance is improved, but a gap between the body and side margin portion occurs resulting in reduced moisture resistance
Solution Approach 1:
The patent merges the side margin portion with the main body by forming an integrated structure where the side margin portion is created through a groove rather than separate attachment. The groove is formed to a depth that exposes the internal electrode pattern, and conductive paste is filled into the groove to create electrical connection while maintaining structural integration with the ceramic body, eliminating gaps that would compromise moisture resistance.
Solution Approach 2:
The patent transitions from a planar side margin attachment (previous technology) to a three-dimensional groove-based integration. The groove extends into the ceramic body along the thickness direction, creating a depth dimension that allows the internal electrode pattern to be exposed while maintaining structural continuity. This dimensional approach enables the side margin to be structurally integrated rather than surface-mounted.
2Ease of manufacture
If the internal electrode pattern is exposed on both side surfaces by cutting the mother laminate, then the internal electrode can be connected, but a gap occurs between the body and side margin portion reducing moisture resistance
Solution Approach 1:
The patent combines the internal electrode connection function with the structural integrity of the ceramic body by forming the connection path through a groove that is integral to the body. The conductive paste is filled into this groove and sintered to create a mechanically and electrically integrated connection, eliminating the need for separate side margin portions that create gaps and moisture pathways.
3Ease of manufacture
If the end of the internal electrode pattern is bent during compression, then the manufacturing process is simple, but electric field concentration occurs causing high-voltage shock and insulation resistance degradation
Solution Approach 1:
The patent applies beforehand cushioning by forming a groove that exposes the internal electrode pattern before the compression process. This pre-formed groove structure prevents the electrode end from bending during compression by providing a defined path and structural support, thereby preventing electric field concentration and insulation resistance degradation while maintaining manufacturing simplicity.
Data Source
AI summary
A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes alternately disposed in a first direction with the dielectric layer interposed therebetween, the first and second internal electrodes spaced apart from fifth and sixth surfaces, first and second external electrodes respectively connected to the first and second internal electrodes, a first through-electrode passing through a space in which the second internal electrode and the fifth surface are spaced apart from each other, the first through-electrode disposed between one ends of two adjacent first internal electrodes in the third direction to connect them, and a second through-electrode passing through a space in which the first internal electrode and the sixth surface are spaced apart from each other, the second through-electrode disposed between one ends of two adjacent second internal electrodes in the third direction to connect them.