Multilayer Capacitor Electrodes Using Vacuum-Deposited Nickel Layers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing multilayer ceramic capacitors face limitations in miniaturization and high-capacity realization due to the thickness constraints of internal electrodes in screen-printing and gravure printing processes, which rely on conductive metal particle pastes, hindering the use of ultra-thin internal electrodes and functional materials.
Innovation Solution
A multilayer electronic component is developed with a body comprising internal electrodes made of multiple nickel layers and a heterogeneous material layer, formed using a vacuum deposition process, allowing for ultra-thin internal electrodes and integration of functional materials, replacing traditional direct printing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If screen-printing or gravure printing process is used to form internal electrode, then manufacturing process is simple and reliable, but internal electrode thickness cannot be reduced below certain limit
Solution Approach 1:
The patent replaces the mechanical screen-printing or gravure printing process with a vacuum deposition process. This substitution enables the formation of ultra-thin internal electrodes (5 nm to 50 nm thickness) that cannot be achieved by conventional printing methods, while maintaining manufacturing feasibility through established vacuum deposition technology.
Solution Approach 2:
The patent changes the fundamental formation parameter of internal electrodes from paste-based printing to atomic-layer vacuum deposition. This parameter change allows precise control of electrode thickness at the nanometer scale and enables the use of functional materials that cannot be incorporated into traditional conductive pastes.
2Volume of moving object
If internal electrode thickness is reduced to achieve miniaturization, then component size decreases and capacity increases, but electrical properties and connectivity deteriorate
Solution Approach 1:
The patent employs composite material structures for internal electrodes, combining multiple layers including conductive layers, barrier layers, and functional material layers. This composite approach maintains electrical connectivity and reliability even when total electrode thickness is reduced to ultra-thin dimensions, as each layer contributes specific properties that compensate for the reduced overall thickness.
Solution Approach 2:
The patent compensates for reduced electrode thickness by optimizing other dimensional parameters, such as increasing the surface area of electrodes through pattern design and improving the dielectric layer properties. This dimensional compensation ensures that capacitance and electrical performance are maintained despite miniaturization.
3Adaptability or versatility
If traditional conductive metal particle paste is used, then internal electrode can be formed easily, but functional materials cannot be integrated and electrode thickness is limited
Solution Approach 1:
The vacuum deposition process used in the patent provides universal applicability for depositing various materials including metals, metal oxides, nitrides, and other functional materials. This multi-functional capability allows the same manufacturing process to form both conductive internal electrodes and integrate functional materials with special properties, eliminating the need for separate processing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the realization of miniaturized and high-capacity multilayer ceramic capacitors with improved electrical and physical properties, overcoming the thickness limitations of traditional processes and enabling the use of functional materials for enhanced performance.
Implementation Method 1
performing vacuum deposition to form: (i) a first layer including nickel, (ii) a layer including a heterogeneous material on the first layer, and (iii) a second layer including nickel on the layer including the heterogeneous material
Data Source
AI summary
A multilayer electronic component includes a body including a plurality of internal electrodes and a dielectric layer disposed between the plurality of internal electrodes; and an external electrode disposed on the body and connected to the plurality of internal electrodes, wherein each of the plurality of internal electrodes includes a plurality of nickel layers, and a heterogeneous material layer provided between the plurality of nickel layers.


