Multilayer Capacitor Via Layout for Crack-Resistant Electrode Connections
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Solution Overview
Problem
Multilayer ceramic capacitors (MLCCs) face issues such as internal electrode shrinkage and cracking during the firing process, leading to broken connections between internal and external electrodes, which reduces capacitance.
Innovation Solution
The multilayer electronic component features a design with internal electrodes alternately disposed with dielectric layers, including connection electrodes that penetrate the dielectric layer to connect adjacent electrodes, and via electrodes that are shifted perpendicularly to enhance mechanical strength and electrical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If internal electrodes are disposed alternately with dielectric layers in a multilayer structure, then capacitance is increased and small size is achieved, but internal electrode shrinkage and cracking occur during firing process
Solution Approach 1:
The internal electrodes are divided into multiple segments along the thickness direction, with each segment connected to external electrodes through via electrodes. This segmentation prevents continuous shrinkage and cracking across the entire electrode structure during firing, while maintaining overall electrical connectivity and capacitance.
Solution Approach 2:
Via electrodes are introduced as intermediary elements to connect the segmented internal electrodes to external electrodes. These via electrodes act as mediators that maintain electrical connectivity even when internal electrodes experience shrinkage or cracking during the firing process, thus preventing connection failure.
2Strength
If via electrodes are shifted perpendicularly to each other, then mechanical strength is improved, but manufacturing precision requirements increase
Solution Approach 1:
Adjacent via electrodes are deliberately positioned at different lateral positions (shifted in the perpendicular direction) rather than being aligned vertically. This asymmetric arrangement creates a staggered pattern that distributes mechanical stress more evenly, improving overall mechanical strength and resistance to cracking during firing.
Solution Approach 2:
The via electrode positions are optimized in both the thickness direction and the lateral direction (perpendicular shift). This multi-dimensional positioning strategy allows the structure to achieve enhanced mechanical strength through staggered arrangement while maintaining manufacturability by distributing alignment tolerances across multiple dimensions.
Data Source
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AI summary
A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer, and including first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction; a first external electrode disposed on at least one surface among the first, second, fifth and sixth surfaces; a second external electrode disposed on at least one surface among the first, second, third and fourth surfaces; and a first connection electrode penetrating the dielectric layer and connecting two first internal electrodes adjacent to each other in the first direction. In the first connection electrode, a plurality of first via electrodes shifted from each other in a direction perpendicular to the first direction are laminated in the first direction.