Multi-Layer Electronic Case Structure for Impact Protection
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Solution Overview
Problem
Existing protective cases for electronic devices suffer from issues such as material degradation, bulkiness, difficulty in carrying, reduced protection over time, interference with device performance, and inadequate cushioning, leading to device damage and case separation during normal use.
Innovation Solution
A multi-layered composite case comprising an electronic device cradle with interconnected walls, a shear plate, a frame, and a backing layer made of materials with varying rigidities and resiliencies, providing a sandwich construction that distributes and dissipates impact forces while maintaining device functionality and aesthetics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a rigid injected plastic case is used, then structural protection is improved, but material stresses are passed to the electronic device causing potential damage
Solution Approach 1:
The case combines rigid injected plastic with overmolded thermoplastic polyurethane rubber to create a composite structure. The rigid base provides structural strength while the resilient overmold layer absorbs and distributes impact forces, preventing stress concentration on the electronic device.
Solution Approach 2:
Different regions of the case have different material properties - the base uses rigid material for structural support while the outer surface uses soft resilient material for impact absorption. This local differentiation allows each region to perform its specific function optimally.
2Strength
If a rubber protective case is used, then impact resistance is improved, but friction interference occurs making attachment and grip difficult
Solution Approach 1:
The case applies resilient rubber material selectively on specific surfaces that contact the user's hand, while keeping other areas smoother. This localized approach provides grip enhancement where needed without creating excessive friction that would interfere with attachment or overall handling.
3Strength
If a bulky case design is used, then protection capability is improved, but portability is reduced making it difficult to carry
Solution Approach 1:
The case utilizes a thin-walled injected plastic structure reinforced with strategically placed rigid ribs and supported by a resilient overmold layer. This flexible shell design provides adequate protection without requiring thick walls throughout, thereby minimizing weight and bulk while maintaining protective capabilities.
4Ease of manufacture
If a single-material case is used, then manufacturing simplicity is improved, but material degradation occurs over time reducing protective capability
Solution Approach 1:
The case uses a two-material composite construction with a rigid injected plastic base and a thermoplastic polyurethane rubber overmold. This composite structure combines materials with complementary properties - the rigid base provides structural integrity while the resilient overmold resists degradation from UV exposure, oxidation, and mechanical wear, ensuring long-term reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The case effectively protects electronic devices from impacts, scratches, and slippage, while ensuring full functionality and compliance with military standards, while minimizing weight and bulk, through a combination of materials with different properties.
Implementation Method 1
The multi-layered composite case is adapted to house the electronic device in a predetermined orientation with, when housed, the two or more inter-connected walls adjacent to at least a portion of a perimetral portion of the device and the base adjacent to a back of the device wherein the two or more inter-connected walls are comprised of a resilient and impact resistant material
Implementation Method 2
A multi-layered composite case design featuring interconnected walls, a shear plate, and a backing layer with varying rigidities, forming a sandwich construction that provides impact resistance
Data Source
AI summary
A sandwich construction, integrated multi-layered case for an electronic device is provided herein, including methods of production and protecting an electronic device.