Multilayer Ceramic Component Bottom Electrode Groove Formation
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Solution Overview
Problem
Existing multilayer electronic component manufacturing methods face challenges in forming outer electrodes with high dimensional accuracy on the bottom surface of the multilayer body at a low cost, particularly due to difficulties in precision when using the dip method.
Innovation Solution
The method involves forming a groove on the bottom surface of the multilayer body, segmenting it into chip regions, and then forming an outer electrode conductor layer, using dicer blades for precise cutting and holding layers to maintain stability and prevent scattering, allowing for accurate and cost-effective formation of outer electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the dip method is used to form the outer electrode, then the manufacturing cost is low and the process is simple, but the dimensional accuracy of the outer electrode on the bottom surface is poor
Solution Approach 1:
The patent applies preliminary action by forming the groove on the bottom surface before segmenting the multilayer body into chips. This preliminary groove formation enables subsequent outer electrode material to be precisely positioned and formed with high dimensional accuracy on the bottom surface, while still allowing the use of cost-effective dip coating or screen printing methods for the actual electrode formation.
2Manufacturing precision
If the groove is formed and segmentation is performed, then the outer electrode with predetermined shape and high dimensional accuracy can be formed, but the manufacturing process becomes more complex
Solution Approach 1:
The patent merges multiple functions into the groove structure: it serves as both a positioning feature for the outer electrode and a structural element that defines the electrode shape. By combining the groove formation with the segmentation process and utilizing the groove walls for electrode material containment, the patent reduces the need for additional separate steps to achieve precise electrode geometry.
3Manufacturing precision
If the outer electrode is formed on the bottom surface after groove formation and segmentation, then high dimensional accuracy is achieved, but the production time increases
Solution Approach 1:
The patent maintains continuity of useful action by performing groove formation and segmentation in a continuous manufacturing flow without interrupting the production line. The groove is formed on the bottom surface, then the body is segmented into chips, and the outer electrode is formed in the groove - all steps are performed sequentially without breaking the manufacturing continuity, minimizing idle time while achieving high precision.
Data Source
AI summary
A multilayer electronic component manufacturing method includes forming a multilayer body including a plurality of ceramic layers, and forming a groove by removing a part of a bottom surface of the multilayer body. The method further includes segmenting the multilayer body by dividing the multilayer body into a plurality of chip regions, and forming an outer electrode conductor layer on the bottom surface of the multilayer body after formation of the groove and segmentation.