Multilayer Ceramic Component Rounded Chamfers
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Solution Overview
Problem
Miniaturization of multilayer ceramic electronic components leads to increased side gap ratios, reducing capacitor capacity and causing delamination issues due to stress concentration at corners during cutting, particularly at external layers without side gap regions.
Innovation Solution
Incorporating rounded chamfer portions and dummy electrodes with specific dimensions and arrangements to minimize stress concentration and ensure close adhesion between ceramic layers, preventing delamination and reducing the step problem.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the thickness of ceramic layers is decreased to increase capacity, then the number of ceramic layers increases, but the ratio of side gap region area to internal electrode area increases, reducing capacity
Solution Approach 1:
The patent applies preliminary action by forming rounded chamfer portions at the corners of the green chip before lamination and cutting. This pre-shaping prevents stress concentration during subsequent cutting and lamination processes, eliminating the need for large side gap margins while maintaining manufacturing precision.
Solution Approach 2:
The patent changes the geometric parameter of the green chip corners from sharp angles to rounded chamfer portions. This parameter change reduces stress concentration during cutting, allowing smaller side gap regions and thereby increasing the effective internal electrode area ratio and capacitor capacity.
2Quantity of substance
If side gap regions are removed to increase capacity, then the area ratio of internal electrode increases, but stress concentration during cutting causes delamination at corner portions
Solution Approach 1:
The patent applies preliminary action by pre-forming rounded chamfer portions at the corners of the green chip before cutting. This preliminary shaping prevents stress concentration during the cutting process, eliminating delamination at corner portions while allowing removal of side gap regions to increase capacity.
Solution Approach 2:
The rounded chamfer portions act as beforehand cushioning by providing a stress-distributing geometry that prevents stress concentration during cutting. This cushioning effect protects the corner portions from delamination while enabling the reduction of side gap regions.
3Length of moving object
If corner portions with small adhesion area are present, then miniaturization is achieved, but these corners function as starting points for delamination due to stress concentration
Solution Approach 1:
The patent applies spheroidality by rounding the corner portions of the green chip instead of leaving sharp angles. This curvature distributes stress evenly during cutting and lamination, preventing stress concentration that would initiate delamination, while maintaining the miniaturized component size.
Solution Approach 2:
The patent applies preliminary action by pre-forming the rounded chamfer portions before cutting and lamination. This preliminary shaping ensures that corner portions with small adhesion areas do not become delamination starting points, enabling reliable miniaturization.
Data Source
AI summary
In a multilayer ceramic electronic component, dummy electrodes are located in margin regions. In a region between an extension line of a side of a facing portion of an internal electrode facing a side surface of an element body and a side of an extending portion of the internal electrode facing the side surface, the dummy electrode is arranged not to extend to the extension line of the side facing the side surface. The dummy electrode includes a plurality of electrode pieces linearly extending in the direction parallel or substantially parallel to the side surface.