Multilayer Ceramic Component Toppling Prevention via Electrode Connectivity
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Solution Overview
Problem
Multilayer ceramic electronic components with increased stacked layers for high capacitance often topple over when mounted on printed circuit boards due to their thickness exceeding their width, leading to increased failure rates in mounting.
Innovation Solution
A multilayer ceramic electronic component design where the ceramic body has a thickness greater than its width, with specific electrode connectivity and thickness ratios, and a manufacturing method involving stacked ceramic sheets with internal electrodes and external electrodes formed to ensure stable mounting, including a method to adjust internal electrode thickness for improved connectivity and reduced convex shape.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of stacked layers is increased to achieve high capacitance, then the capacitance degree is improved, but the thickness becomes greater than the width causing the component to topple over during mounting
Solution Approach 1:
The internal electrode is designed with non-uniform thickness where the thickness in the central region (CW1) is smaller than the thickness in the adjacent regions (CW2, CW3). This local variation in electrode thickness creates a corresponding variation in connectivity (0.02≦(CW2 or CW3)−CW1≦0.10), which generates an internal counterbalancing effect that prevents the component from toppling over while maintaining high capacitance through increased stacked layers
2Volume of moving object
If the thickness of dielectric layers and internal electrodes is reduced to allow more stacked layers, then the component size is miniaturized, but the thickness-to-width ratio increases causing toppling during mounting
Solution Approach 1:
By creating local quality differences in the internal electrode thickness (thinner in central region CW1, thicker in adjacent regions CW2, CW3), the design generates differential connectivity that produces an internal stabilizing effect. This allows the component to maintain a compact size with reduced layer thickness while preventing toppling through the connectivity difference (0.02≦(CW2 or CW3)−CW1≦0.10)
Solution Approach 2:
The internal electrode intentionally introduces asymmetry in its thickness distribution across the width direction, with the central region having different thickness compared to adjacent regions. This asymmetric design creates unequal connectivity in different regions, generating a self-balancing effect that counteracts the toppling tendency caused by the thickness-greater-than-width geometry
3Quantity of substance
If the ceramic body has a vertically convex shape with higher central portion, then high capacitance is achieved through increased stacking, but the toppling problem is intensified during mounting
Solution Approach 1:
The internal electrode is designed with local quality variation where the central region (CW1) has smaller thickness compared to adjacent regions (CW2, CW3). This creates a connectivity difference (0.02≦(CW2 or CW3)−CW1≦0.10) that generates an internal counterbalancing effect, preventing the component from toppling over despite the vertically convex shape of the ceramic body resulting from high-layer stacking
Data Source
AI summary
A multilayer ceramic electronic component includes a ceramic body including dielectric layers stacked in a thickness direction and satisfying T/W>1.0 when a width thereof is W and a thickness thereof is T; first and second internal electrodes; and first and second external electrodes, wherein when the ceramic body is divided into five regions in a width direction and a central region among the five regions is CW1 and regions adjacent to the central region CW1 are CW2 and CW3, a difference between electrode connectivity of the central region CW1 and electrode connectivity of the region CW2 or CW3 satisfies 0.02≦(CW2 or CW3)−CW1≦0.10.