Multilayer Ceramic Component Insulating Layer Elastic Modulus
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Solution Overview
Problem
Multilayer ceramic electronic components face challenges with thermal shock resistance and acoustic noise due to poor adhesion between ceramic side surfaces and applied ceramics, leading to structural defects and noise generation during electrostriction changes.
Innovation Solution
A multilayer electronic component design featuring insulating layers with an elastic modulus of 12 GPa to 140 GPa, integrated insulating layer extensions covering end surfaces, and specific width and thickness ratios, composed of glass components with Bi2O3 and Na2O less than 5 mass%, to enhance adhesion and reduce acoustic noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a ceramic is applied and formed on the side surfaces of the ceramic sintered body, then moisture resistance characteristic is improved and internal defects are prevented, but structural defects occur due to bad adhesion between the side surfaces and the applied ceramic
Solution Approach 1:
The patent introduces a low elastic modulus layer (elastic modulus: 12 GPa to 140 GPa) as an intermediary between the ceramic sintered body and the applied ceramic coating. This intermediate layer improves adhesion between the two ceramic materials, preventing structural defects such as delamination while maintaining the moisture resistance benefits of the ceramic coating.
2Strength
If a ceramic with high elastic modulus is used, then mechanical strength is improved, but acoustic noise is generated at the time of change of electrostriction
Solution Approach 1:
The patent changes the elastic modulus parameter of the insulating layer to a specific range (12 GPa to 140 GPa) that is lower than conventional ceramics. This parameter change reduces the acoustic noise generated during electrostriction while maintaining adequate mechanical strength through the layered structure and material composition control.
Solution Approach 2:
The patent creates a composite structure consisting of the ceramic sintered body and the low elastic modulus insulating layer. This composite material approach combines the mechanical strength of ceramic with the noise-reducing properties of materials having lower elastic modulus, achieving both strength and acoustic noise reduction.
3Object-generated harmful factors
If metal terminals are attached to both ends of the capacitor body to prevent acoustic noise, then acoustic noise is reduced, but the height size becomes large
Solution Approach 1:
The patent extracts and eliminates the need for external metal terminals by integrating the acoustic noise reduction function directly into the insulating layer formed on the capacitor body. This integration removes the additional height component that would be required for metal terminals while maintaining the acoustic noise reduction effect.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved thermal shock resistance and reduced acoustic noise, allowing for compact capacitor designs without the need for metal terminals, while maintaining mechanical strength and moisture resistance.
Implementation Method 1
an elastic modulus of the insulating layer is 12 GPa to 140 GPa
Data Source
AI summary
A multilayer electronic component includes an element body having an internal electrode layer and a dielectric layer. These are substantially parallel to a plane including a first axis and a second axis and are alternately laminated along a third axis direction. Side surfaces facing each other in the first axis direction are respectively equipped with an insulating layer. End surfaces facing each other in the second axis direction are respectively equipped with an external electrode. An elastic modulus of the insulating layer is 12 GPa to 140 GPa.