Multilayer Ceramic Component Plating Voids
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Solution Overview
Problem
Multilayer ceramic capacitors face challenges in achieving smaller sizes and higher capacitances due to increased likelihood of short circuits and limited ceramic layer area expansion, with existing external terminal electrode formation methods resulting in insufficient bonding strength and reliability.
Innovation Solution
A method involving direct plating of a base plating film on the ceramic body's side surfaces to cover exposed inner conductor portions, with voids at the peripheries allowing the plating metal to enter and anchor securely, enhancing bonding strength and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the thickness of ceramic layers is decreased to achieve smaller sizes and larger capacitances, then the capacitance increases and size decreases, but the likelihood of short circuit between internal electrodes increases
Solution Approach 1:
The patent applies local quality by creating a protruding portion of the external terminal electrode that locally extends beyond the ceramic body surface. This localized structural modification allows the electrode to wrap around and contact the inner electrode at a specific location, providing enhanced electrical connection without requiring thicker ceramic layers throughout the entire component.
Solution Approach 2:
The patent transitions from a planar electrode configuration to a three-dimensional structure where the external terminal electrode forms a protruding portion that extends outward and wraps around the inner electrode. This dimensional change enables the electrode to achieve better electrical contact and mechanical support in multiple spatial directions, improving reliability while maintaining thin ceramic layer thickness.
2Quantity of substance
If the effective area of inner electrodes is increased to achieve larger capacitances, then the capacitance increases, but the area of ceramic layers must be increased which exceeds size standards
Solution Approach 1:
The patent utilizes the vertical dimension by creating a protruding portion of the external terminal electrode that extends beyond the ceramic body surface. This allows the electrode to wrap around the inner electrode and provide effective electrical connection without requiring an increase in the planar area of the ceramic layers, thus maintaining compliance with size standards while achieving larger effective electrode area for higher capacitance.
Solution Approach 2:
The patent changes the geometric parameters of the external terminal electrode by forming a protruding portion with specific dimensions (extending beyond the ceramic body surface). This parameter modification enables the electrode to achieve better electrical contact and mechanical support, effectively increasing the functional electrode area without increasing the overall component footprint.
3Ease of manufacture
If a conductive paste is applied by immersion to form external terminal electrode, then the electrode is formed, but the paste adheres to the central portion causing thick electrode sections that reduce ceramic layer area
Solution Approach 1:
The patent replaces the mechanical paste application method (immersion and adhesion) with a plating process. The plating method deposits metal material onto the electrode pattern, forming the external terminal electrode with controlled thickness and distribution. This substitution eliminates the viscosity-related adhesion problem where paste naturally accumulates in the central portion, allowing for more uniform electrode thickness and maximizing the available ceramic layer area.
4Area of stationary object
If direct plating is used to form external terminal electrode, then the electrode thickness is reduced and ceramic layer area is increased, but the bonding strength between electrode and ceramic body becomes insufficient
Solution Approach 1:
The patent applies preliminary action by forming a protruding portion of the external terminal electrode that extends beyond the ceramic body surface before final assembly. This pre-formed structure is then pressed against the inner electrode during assembly, creating mechanical interlocking and enhancing electrical contact. The protruding portion acts as a pre-positioned bonding element that ensures strong adhesion between the external terminal electrode and the inner electrode, compensating for the insufficient bonding strength that would otherwise result from direct plating on thin electrodes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a high-performance multilayer ceramic electronic component with thin external terminal electrodes having improved bonding strength and reliability, while maintaining a thin profile and efficient manufacturing process.
Implementation Method 1
voids at the peripheries allowing the plating metal to enter and anchor securely
Implementation Method 2
direct plating of a base plating film on the ceramic body's side surfaces
Data Source
AI summary
A multilayer ceramic electronic component includes external terminal electrodes that are formed by direct plating on the first and second side surfaces of a ceramic body including stacked ceramic layers and inner conductors. The external terminal electrodes include base plating films formed so as to cover the exposed portions of inner conductors. Voids are provided that are open to the side surfaces of the ceramic body so as to be adjacent to the ends in the width direction of the exposed portions of the inner conductors. A plating metal defining the base plating films enters the voids and is electrically connected to the inner conductors in the ceramic body.