Multilayer Ceramic Component Manufacturing via Pre-Cut Segmentation
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Solution Overview
Problem
The existing methods for manufacturing multilayer ceramic electronic components face issues with deformation and displacement of inner electrode layers during the pressing process, leading to insufficient gaps and compromised insulation reliability, and the use of fillers can negatively affect electric characteristics and reliability.
Innovation Solution
A method involving cutting a green mother laminate to form sectional surfaces, bonding these surfaces, and then pressing to create bonded laminates, which are subsequently separated to prevent deformation and displacement of inner electrode layers, ensuring efficient production of multilayer ceramic components with high reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the mother laminate is pressed to form individual chips, then productivity is improved, but the inner electrode layers may deform and displace, worsening manufacturing precision
Solution Approach 1:
The patent divides the mother laminate into multiple individual chip sections before pressing. By pre-cutting the laminate into sections that will become individual chips, the pressing process no longer causes displacement between sections since they are already separated. This segmentation allows high-speed pressing without compromising electrode layer positioning accuracy.
2Manufacturing precision
If the mother laminate is cut into individual chips before pressing, then inner electrode layer deformation is prevented, but the process complexity increases
Solution Approach 1:
The patent performs the cutting action before pressing, which is the opposite of the conventional approach. By pre-cutting the mother laminate into individual chip sections before the pressing operation, the electrode layers are already in their final positions when pressing occurs. This preliminary action simplifies the overall process by eliminating the need for complex filler handling and post-pressing separation steps.
Data Source
AI summary
A method of manufacturing a multilayer ceramic electronic component includes preparing a green mother laminate in which ceramic layers and inner electrode layers are stacked; cutting the mother laminate perpendicularly or substantially perpendicularly to a main surface of the mother laminate and in a first direction when the mother laminate is viewed in plan such that first sectional surfaces are formed, and pressing the mother laminate to obtain a bonded laminate in which the first sectional surfaces are bonded to each other; and separating the bonded laminate between the first sectional surfaces to obtain laminates. Then, the bonded laminate is cut perpendicularly or substantially perpendicularly to the main surface and in a second direction that intersects the first sectional surfaces such that second sectional surfaces are formed.