Multilayer Ceramic Substrate Fabrication via Film Segmentation
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Solution Overview
Problem
Existing methods for fabricating multilayer substrates using LTCC and HTCC processes are limited in producing structures with thinner layer spacings less than 10 µm and cannot efficiently create larger openings greater than 500 µm, which are necessary for applications like heat sinks in high-power LED substrates.
Innovation Solution
A method involving printing multiple layers of ceramic and metal pastes on a substrate, followed by lamination, decarburization, and sintering, allowing for the production of multilayer substrates with very thin layer spacings and complex structures, including vias and cavities, using screen or inkjet printing techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If LTCC or HTCC processes are used to fabricate multilayer substrates, then structured films can be produced with laser or punching techniques, but the method cannot produce structures with thinner layer spacings less than 10 µm
Solution Approach 1:
The substrate is divided into multiple thin films that are stacked and laminated together. Each film can be independently processed with standard LTCC/HTCC techniques, while the overall structure achieves thin layer spacings through the cumulative effect of multiple thin layers. This segmentation allows the use of conventional fabrication methods to create structures that would otherwise require advanced processing capabilities.
Solution Approach 2:
The invention transitions from planar processing to three-dimensional stacking. By creating multiple thin films in separate processing steps and then stacking them vertically, the method achieves thin layer spacings in the vertical dimension while maintaining compatibility with standard horizontal processing techniques for each individual film.
2Ease of manufacture
If laser or punching techniques are used to create vias, then through-holes can be formed, but openings greater than 500 µm cannot be efficiently produced
Solution Approach 1:
Large openings are created by stacking multiple films, each containing smaller via structures. The individual vias in each film are within the capability range of laser or punching techniques (20-300 µm), but the cumulative effect of stacking multiple such films creates the equivalent of larger openings while maintaining manufacturing feasibility.
Solution Approach 2:
The structure employs nested via configurations where smaller vias in one film align with and connect to vias in adjacent films. This nesting approach allows the creation of effective large openings through the stack while each individual via remains within the processing capabilities of standard equipment.
3Adaptability or versatility
If screen printing or inkjet printing is used to apply pastes, then complex structures with arbitrary shapes can be produced, but the process requires multiple printing and drying steps
Solution Approach 1:
The complex multilayer structure is divided into multiple simpler film layers, each requiring fewer printing steps. By distributing the complexity across multiple stacked films rather than attempting to create the entire structure in a single film, the total number of printing and drying cycles is reduced while maintaining the capability to produce arbitrary shapes and complex geometries.
Solution Approach 2:
Individual films are pre-printed with their specific patterns and then stacked. This preliminary processing of separate films allows for optimized printing parameters for each layer type and enables parallel processing of multiple films, reducing the overall process complexity compared to attempting to print the entire multilayer structure sequentially in a single operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the fabrication of 2.5D and 3D multilayer structures with thin layer spacings and arbitrary shapes, suitable for applications requiring integrated heat sinks and complex geometries.
Implementation Method 1
printing is carried out by applying the pastes to a substrate from which the dried pastes are peeled off as a film
Implementation Method 2
During lamination, heat is applied to the films to create a strong bond between the paste structures of the areas
Implementation Method 3
Further manufacturing steps include pressing, in which pressure can be applied to the film stack during the lamination process
Implementation Method 4
The process for manufacturing a multilayer or multi-layer substrate comprises: producing films by printing a first area with a first paste and printing a second area with a second paste, wherein the printing is carried out by applying the pastes to a substrate from which the dried pastes are peeled off as a film, stacking the films, and laminating them
Data Source
Figure 1~2
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AI summary
Method for producing a multilayer carrier body (15) comprising: • producing films (10) by printing a first area (2, 11, 12) with a first paste and printing a second area (2, 11, 12) with a second paste, • stacking the films (10), • lamination.