Multilayer Chip Electrode Formation via Inkjet Printing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing method for manufacturing electronic components with multilayer chips experiences issues with dimensional accuracy due to high viscosity conductive paste leading to increased film thickness and 'upward wetting' phenomena, making it difficult to control external electrode dimensions and areas effectively.
Innovation Solution
A method involving the insertion of multilayer chips into cavities in a pallet, alignment with inner wall surfaces, application of conductive ink using an ink-jet method, and drying to form external electrodes, while utilizing a liquid repellent film or slope surfaces to minimize ink blot and enhance alignment accuracy, reducing the 'upward wetting' phenomenon.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If high viscosity conductive paste is used, then the conductive layers are increased in film thickness, but the dimensional accuracy in thickness deteriorates
Solution Approach 1:
The patent changes the physical state of the conductive material from paste to ink, and further to conductive ink with specific properties. This parameter change allows for better control of film thickness and dimensional accuracy while maintaining the required conductive layer quantity.
Solution Approach 2:
The patent replaces the conventional paste application method with an inkjet-based application method. This substitution enables precise control of the conductive layer thickness and area, eliminating the dimensional accuracy problems associated with high viscosity paste.
2Manufacturing precision
If the viscosity of the conductive paste is lowered to reduce the conductive layers in film thickness, then the dimensional accuracy may improve, but a so-called 'upward wetting' phenomenon occurs, making it difficult to control the area of the external electrode
Solution Approach 1:
The patent changes the material from conductive paste to conductive ink with optimized viscosity and surface tension properties. This parameter change eliminates the upward wetting phenomenon while maintaining good controllability of the external electrode area.
Solution Approach 2:
The patent replaces the dip-coating method with an inkjet printing method. This substitution provides precise control over the conductive ink application, preventing upward wetting and enabling accurate control of external electrode area and shape.
3Ease of manufacture
If conventional dip coating method is used, then the process is simple, but the alignment accuracy deteriorates and labor for alignment increases
Solution Approach 1:
The patent replaces the conventional dip-coating method with an inkjet printing system that includes automated alignment functionality. This substitution maintains process simplicity while dramatically improving alignment accuracy through automated positioning and printing head control.
4Reliability
If conductive paste is applied to multilayer chips, then external electrodes are formed, but ink blot on the pallet occurs, increasing the defective percent
Solution Approach 1:
The patent replaces the dip-coating method with inkjet printing, which applies conductive ink directly to the multilayer chips without contact with the pallet surface. This substitution eliminates ink blot on the pallet, reducing defects and improving reliability.
Solution Approach 2:
The patent uses the multilayer chip itself as an intermediary to receive the conductive ink directly at the application location. This prevents the ink from contacting the pallet surface, eliminating the ink blot problem that causes defects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves dimensional accuracy and reduces defects by minimizing ink blot on the pallet, allowing for efficient and precise formation of external electrodes without the 'upward wetting' issue, even at lower viscosity levels.
Implementation Method 1
a fourth step of drying the applied conductive ink to form external electrodes on the plurality of multilayer chips
Data Source
AI summary
A method for manufacturing an electronic component, and a device for manufacturing the electronic component, which can easily achieve alignment by inserting multilayer chips into cavities formed in a pallet, and form external electrodes with a high degree of dimensional accuracy. A plurality of multilayer chips each composed of a laminated body with a plurality of ceramic layers and a plurality of internal electrode layers is inserted into each of a plurality of cavities formed in a pallet, and the plurality of multilayer chips is aligned by moving each of the plurality of multilayer chips to one of inner wall surfaces forming the cavity. A conductive ink is applied onto ends of the plurality of aligned multilayer chips, including the upper surface of the pallet, and the conductive ink applied is dried to form external electrodes on the plurality of multilayer chips.