Multi-Layer Circuit Board Manufacturing via Single Lamination
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Solution Overview
Problem
The existing process for manufacturing multilayer printed circuit boards is lengthy and costly due to the need for sequential lamination of single electrically conductive layers, which limits efficiency and increases production time.
Innovation Solution
A method involving the use of copper clad laminates with plated through holes and dielectric layers, where multiple circuit substrates are formed and laminated in a single process, allowing for simultaneous electrical connectivity and reducing the number of lamination steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If sequential lamination of single electrically conductive layers is used, then manufacturing precision and reliability are maintained, but manufacturing time and cost increase significantly
Solution Approach 1:
The patent merges multiple separate lamination operations into a single lamination step by using pre-assembled copper clad laminates as unified building blocks. Each copper clad laminate contains multiple copper layers and dielectric layers pre-laminated together, allowing these pre-assembled units to be laminated onto the core substrate simultaneously in one operation, thereby reducing total manufacturing time while maintaining precision through standardized components
Solution Approach 2:
The patent applies preliminary action by pre-laminating multiple copper layers and dielectric layers into complete copper clad laminates before the final assembly step. This pre-assembly includes forming copper layers, creating via holes, and laminating dielectric layers in advance, so that when these copper clad laminates are placed on the core substrate, they require only a single lamination operation rather than multiple sequential steps
2Ease of manufacture
If sequential lamination of single electrically conductive layers is used, then process control is simplified, but productivity decreases
Solution Approach 1:
The patent combines multiple manufacturing operations into unified process steps. By pre-assembling copper clad laminates that contain multiple layers and functions, the patent reduces the number of separate lamination, etching, and via formation steps required during final assembly, thereby improving productivity while maintaining manageable process control through standardized procedures
Solution Approach 2:
The patent segments the circuit board into modular copper clad laminates that can be independently manufactured and then assembled. This segmentation allows parallel manufacturing of multiple copper clad laminates simultaneously, increasing overall productivity, while each module remains simple enough to maintain ease of manufacture and process control
3Reliability
If multiple lamination steps are performed, then electrical connectivity between layers is ensured, but manufacturing cost increases
Solution Approach 1:
The patent performs preliminary actions by pre-forming via holes and establishing electrical connections within each copper clad laminate during its manufacturing process. This includes creating conductive paths through the dielectric layers and plating copper into via holes before the final assembly, ensuring electrical connectivity is already verified and secured before lamination, thereby reducing the need for additional connection steps and lowering manufacturing costs
Solution Approach 2:
The patent combines multiple functions into the copper clad laminate structure itself. The dielectric layers, copper conductive layers, and via connections are all integrated into single pre-assembled units, eliminating the need for separate lamination steps for each function. This integration maintains reliable electrical connectivity while reducing the number of expensive manufacturing steps required
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces manufacturing time and costs by enabling the formation of multilayer circuit boards in a single lamination process, enhancing production efficiency and increasing the rate of finished products.
Implementation Method 1
a plated through hole (114) is formed in each copper clad laminate (110)
Data Source
AI summary
A method for manufacturing a multi-layer circuit board includes steps of: providing three copper clad laminates; forming trace layers in each copper clad laminate by selectively removing portions of copper layer of each copper clad laminate to obtain three first circuit substrates; laminating a dielectric layer on two of the first circuit substrates to obtain two second circuit substrates; forming a metal bump on the trace layer he other one of the three first circuit substrate to obtain a third circuit substrate; stacking and laminating the third circuit substrate between the two second circuit substrate to obtain a multi-layer circuit board.