Multilayer Circuit Board Low Inductance Ceramic Resin
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Solution Overview
Problem
Existing multilayer circuit boards face limitations in increasing operation frequency due to high inductance and thickness, which restricts their performance in high-frequency applications.
Innovation Solution
A multilayer circuit board design featuring a ceramic substrate with alternating thin-film conductive layers and resin insulation layers, where the resin insulation layers have low relative permittivity and thickness, reducing inductance and allowing for a thinner profile, thereby enabling higher operation frequencies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If resin insulation layers are used in multilayer circuit boards, then ease of manufacture is improved, but inductance increases and operation frequency is limited
Solution Approach 1:
The patent changes the material parameter of the insulation layer from conventional resin to low-permittivity resin, which has a relative permittivity of 3.0 or less. This parameter change reduces the inductance of the circuit board while maintaining the multilayer structure and manufacturing processes, thereby resolving the contradiction between ease of manufacture and low inductance requirement for high-frequency operation
2Stability of the object's composition
If multiple thick insulation layers are used, then structural stability is improved, but inductance increases and operation frequency decreases
Solution Approach 1:
The patent uses low-permittivity resin with relative permittivity of 3.0 or less, which allows the insulation layers to be made thinner while maintaining adequate insulation performance. This reduces the overall thickness of the circuit board and the length of through-conductors, thereby reducing inductance while preserving structural stability through the optimized layer configuration
3Strength
If through-conductors are made long to penetrate thick substrates, then structural integrity is improved, but inductance increases and high-frequency performance deteriorates
Solution Approach 1:
The patent reduces the length of through-conductors by using thinner insulation layers made from low-permittivity resin. The shortened through-conductors maintain sufficient structural integrity for mechanical strength while significantly reducing inductance, enabling the circuit board to operate at higher frequencies up to 100 GHz and beyond
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves lower inductance and a thinner profile, allowing for increased operation frequencies and improved performance in high-frequency applications.
Implementation Method 1
to have low relative permittivity of the insulation layers compared to resin insulation layers
Data Source
AI summary
A multilayer circuit board comprising low inductance through-conductors is disclosed. The multilayer circuit board comprises first ceramic substrate means, first layered section means, and second ceramic substrate means that allow insulation layers to be substantially thin, a length of through-conductors to be substantially short, and low relative permittivity of the insulation layers compared to resin insulation layers. Thus, increases in operation frequency of the multilayer circuit board are possible.