Multilayer Circuit Board Structure for Broadband Electromagnetic Noise Suppression
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Solution Overview
Problem
Conventional high impedance surface electromagnetic bandgap (HIS EBG) structures are ineffective in providing broad stop band bandwidth and occupy large areas, making them inefficient for suppressing simultaneous switching noise (SSN) in power integrity designs.
Innovation Solution
A multilayer circuit board structure with a periodic arrangement of crystals and conducting channels, forming an equivalent parallel plate transmission line circuit that functions as a band stop filter, offering a wider stop band bandwidth while occupying less area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional HIS EBG structures are used to suppress electromagnetic noise, then noise suppression is achieved within a desired band, but the stop band bandwidth is narrow and the area occupation is large
Solution Approach 1:
The patent transitions from a conventional two-dimensional mushroom-shaped EBG structure to a three-dimensional multilayer crystal structure. The crystal comprises multiple conducting planes (first, second, third, and fourth conducting planes) arranged in different layers and connected through conducting connectors, forming a立体 periodic structure that achieves broader stop band bandwidth and reduced area occupation compared to planar designs
Solution Approach 2:
The multilayer crystal structure is divided into multiple conducting planes and conducting connectors, with each plane and connector serving specific functions in the electromagnetic noise suppression mechanism. The structure is periodically arranged in space, creating multiple unit cells that collectively enhance the stop band characteristics
2Reliability
If conventional HIS EBG structures are used to suppress electromagnetic noise, then noise suppression is achieved within a desired band, but the stop band bandwidth is narrow
Solution Approach 1:
The patent transitions from a conventional two-dimensional mushroom-shaped EBG structure to a three-dimensional multilayer crystal structure. The crystal comprises multiple conducting planes (first, second, third, and fourth conducting planes) arranged in different layers and connected through conducting connectors, forming a立体 periodic structure that achieves broader stop band bandwidth and reduced area occupation compared to planar designs
Solution Approach 2:
The structure combines multiple conducting planes and conducting connectors to form a composite electromagnetic structure. The first and third conducting planes are electrically connected through first conducting connectors, while the second and fourth conducting planes are electrically connected through second conducting connectors, creating a composite structure with enhanced electromagnetic properties and broader frequency response
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The multilayer circuit board structure effectively suppresses undesired electromagnetic wave propagation across a specific frequency band, providing broader stop band bandwidth and more cost-effective electromagnetic noise isolation compared to conventional mushroom-shaped EBG structures.
Implementation Method 1
suppress the undesired electromagnetic wave propagation within a specific frequency band
Implementation Method 2
The stack of the partition of the first outer metallic conducting plane 110, the inner metallic conducting patch 120, and the partition of the second outer metallic conducting plane 130 form a capacitive element
Implementation Method 3
The capacitive element is connected in series with an inductive element formed by the via 140
Data Source
AI summary
An exemplary embodiment of the present disclosure illustrates a multilayer circuit board structure, for suppressing the undesired electromagnetic wave propagation within a specific frequency band. The multilayer circuit board structure includes a plurality of crystals and a plurality of conducting channels, wherein a crystal includes a first through fourth conducting planes, at least a first conducting connector, and at least a second conducting connector, wherein the first through the fourth conducting planes are substantially parallel to each other. The first conducting plane is electrically connected to the third conducting plane through the first conducting connector. The fourth conducting plane is electrically connected to the second conducting plane through the second conducting connector. The first and the third conducting planes are configured to be electrically separated from the second and the fourth conducting planes. Furthermore, the conducting channels are for electrically connecting between crystals in the multilayer circuit board structure.